GWIXP465BAB Intel, GWIXP465BAB Datasheet - Page 40
GWIXP465BAB
Manufacturer Part Number
GWIXP465BAB
Description
Manufacturer
Intel
Datasheet
1.GWIXP465BAB.pdf
(163 pages)
Specifications of GWIXP465BAB
Core Operating Frequency
266MHz
Operating Supply Voltage (typ)
1.3/1.5/2.5/3.3V
Operating Supply Voltage (max)
1.575/2.7/3.465V
Operating Supply Voltage (min)
1.235/2.3/3.135V
Package Type
BGA
Pin Count
544
Mounting
Surface Mount
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
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Package Information
4.0
4.1
4.1.1
May 2005
40
Package Information
This section contains information on the following topics:
Package Description
The IXP45X/IXP46X network processors are built using a 544-ball, plastic ball grid array (PBGA)
package with a drop-in heat spreader (H).
For all extended temperature products and the 667-MHz speed option of the commercial
temperature product, a 10-mm-high, thermal-adhesive-based heat sink will be required. The heat
sink does not force the addition of any surface area to the board design.
Package Drawings
The package is shown in
•
•
•
•
“Package Description”
Numbers”
“Functional Signal Definitions” on page 46
“Signal-Pin Descriptions” on page 89
“Package Thermal Specifications” on page 114
Figure 5
Intel
which includes
®
IXP45X and Intel
and
Figure
“Package
6.
®
IXP46X Product Line of Network Processors Datasheet
Drawings”,
“Package
Document Number:
Markings”, and
306261-002
“Part
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