STM32W108HBU6 STMicroelectronics, STM32W108HBU6 Datasheet - Page 194

• Manufacturer Part Number: STM32W108HBU6
• Manufacturer: STMicroelectronics

Specifications of STM32W108HBU6

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.18V
• Operating Supply Voltage (typ): 1.25V
• Operating Supply Voltage (max): 1.32V
• Package Type: VFQFPN EP
• Pin Count: 40
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Electrical characteristics
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Table 52.
ARM
memory sleep current
ARM
memory sleep current
Serial controller current
General purpose timer current
General purpose ADC current
Rx current
Radio receiver, MAC, and
baseband
Total RX current ( = I
MAC and baseband, CPU
Flash memory )
Boost mode total RX current ( =
I
CPU
Tx current
Radio transmitter, MAC, and
baseband
Radio receiver, MAC and baseband,
+ I
®
®
RAM, and Flash memory )
Cortex-M3, RAM, and flash
Cortex-M3, RAM, and flash
Parameter
DC electrical characteristics (continued)
Radio receiver,
+ I
RAM, and
Doc ID 16252 Rev 7
25 °C, 1.8 V memory and
1.25 V core
ARM
12 MHz from the crystal
oscillator
Radio and all peripherals off
25 °C, 1.8 V memory and
1.25 V core
ARM
6 MHz from the high frequency
RC oscillator
Radio and all peripherals off
For each controller at
maximum data rate
For each timer at maximum
clock rate
At maximum sample rate, DMA
enabled
ARM
VDD_PADS = 3.0 V, 25 °C,
ARM
12 MHz
VDD_PADS = 3.0 V, 25 °C,
ARM
24 MHz
VDD_PADS = 3.0 V, 25 °C,
ARM
12 MHz
VDD_PADS = 3.0 V, 2 5°C,
ARM
24 MHz
25 °C and 1.8 V core; max.
power out (+3 dBm typical)
ARM
®
®
®
®
®
®
®
®
Cortex-M3 clocked at
Cortex-M3 clocked at
Cortex-M3 sleeping
Cortex-M3 running at
Cortex-M3 running at
Cortex-M3 running at
Cortex-M3 running at
Cortex-M3 sleeping
Conditions
STM32W108CB, STM32W108HB
Min.
–
–
–
–
–
–
–
–
–
–
–
Typ.
0.25
22.0
25.0
26.5
27.0
28.5
26.0
3.0
2.0
0.2
1.1
Max.
–
–
–
–
–
–
–
–
–
–
–
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA