AD9788BSVZ Analog Devices Inc, AD9788BSVZ Datasheet - Page 6

• Manufacturer Part Number: AD9788BSVZ
• Description: IC DAC 16BIT 800MSPS 100TQFP
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9788BSVZ

• Data Interface: Serial
• Design Resources: Powering the AD9788 Using ADP2105 for Increased Efficiency (CN0141)
• Number Of Bits: 16
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 450mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Resolution (bits): 16bit
• Sampling Rate: 800MSPS
• Input Channel Type: Parallel
• Digital Ic Case Style: QFP
• No. Of Pins: 100
• Operating Temperature Range: -40°C To +85°C
• Number Of Channels: 2
• Resolution: 16b
• Interface Type: Parallel
• Single Supply Voltage (typ): 3.3V
• Dual Supply Voltage (typ): Not RequiredV
• Settling Time: 0.02us
• Architecture: Interpolation Filter
• Power Supply Requirement: Analog and Digital
• Output Type: Current
• Integral Nonlinearity Error: ±3.7LSB
• Single Supply Voltage (min): 3.13V
• Single Supply Voltage (max): 3.47V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: TQFP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9788-EBZ - BOARD EVAL FOR AD9788
• Settling Time: -
• Lead Free Status / Rohs Status: Compliant

AD9785/AD9787/AD9788
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD33 to AGND, DGND, CGND
DVDD33, DVDD18, CVDD18
AGND to DGND, CGND
DGND to AGND, CGND
CGND to AGND, DGND
I120, VREF, IPTAT to AGND
OUT1_P, OUT1_N, OUT2_P, OUT2_N,
P1D[15] to P1D[0], P2D[15] to P2D[0]
DATACLK, TXENABLE to DGND
REFCLK+, REFCLK−, RESET, IRQ,
RESET, IRQ, PLL_LOCK, SYNC_O+,
Junction Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
to AGND, DGND, CGND
AUX1_P, AUX1_N, AUX2_P,
AUX2_N to AGND
to DGND
PLL_LOCK, SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I− to CGND
SYNC_O−, SYNC_I+, SYNC_I−,
SPI_CSB, SCLK, SPI_SDIO, SPI_SDO
to DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
125°C
−65°C to +150°C
Rev. A | Page 6 of 64
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed paddle
(EPAD) must be soldered to the ground plane. Note that these
specifications are valid with no airflow movement.
Table 5. Thermal Resistance
Resistance
θ
θ
θ
ESD CAUTION
JA
JB
JC
Unit
19.1°C/W
12.4°C/W
7.1°C/W
Conditions
EPAD soldered. No airflow.
EPAD soldered. No airflow.
EPAD soldered. No airflow.