MAX5590BEUG+ Maxim Integrated Products, MAX5590BEUG+ Datasheet - Page 31

• Manufacturer Part Number: MAX5590BEUG+
• Description: IC DAC 12BIT OCTAL BUFF 24-TSSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX5590BEUG+

• Settling Time: 3µs
• Number Of Bits: 12
• Data Interface: Serial
• Number Of Converters: 8
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP
• Resolution: 12 bit
• Interface Type: Serial (SPI)
• Supply Voltage (max): 5.25 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Supply Current: 3.2 mA
• Voltage Reference: External
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Bypass the analog and digital power supplies by using a
10µF capacitor in parallel with a 0.1µF capacitor to AGND
and DGND (Figure 10). Minimize lead lengths to reduce
lead inductance. Use shielding and/or ferrite beads to fur-
ther increase isolation.
Digital and AC transient signals coupling to AGND can
create noise at the output. Connect AGND to the high-
est quality ground available. Use proper grounding
techniques, such as a multilayer board with a low-
Figure 10. Bypassing Power Supplies AV
10µF*
V
Power-Supply and Layout Considerations
REF
**CONNECT ANALOG AND DIGITAL GROUND PLANES AT THE
*REMOVE BYPASS CAPACITORS ON REF FOR AC-REFERENCE INPUTS.
LOW-IMPEDANCE POWER-SUPPLY SOURCE.
0.1µF*
UPIO1
UPIO2
SCLK
DSP
DIN
CS
PU
REF
Buffered, Fast-Settling, Octal, 12/10/8-Bit,
______________________________________________________________________________________
AV
DD
AV
AGND**
DD
MAX5590–MAX5595
0.1µF
10µF
DD
DV
, DV
DD
DV
MAX5591
MAX5593
MAX5595
DD
DGND**
ONLY
DD
, and REF
0.1µF
OUTA
OUTH
FBA
FBH
10µF
inductance ground plane. Wire-wrapped boards and
sockets are not recommended. For optimum system
performance, use PC boards with separate analog and
digital ground planes. Connect the two ground planes
together at the low-impedance power-supply source.
Using separate power supplies for AV
improves noise immunity. Connect AGND and DGND at
the low-impedance power-supply sources (Figure 11).
Figure 11. Separate Analog and Digital Power Supplies
Voltage-Output DACs
ANALOG SUPPLY
AV
AV
DD
DD
0.1µF
10µF
MAX5590–MAX5595
AGND
AGND
DV
DV
DIGITAL SUPPLY
DD
DD
0.1µF
10µF
DGND
DGND
DV
DD
CIRCUITRY
DIGITAL
DD
DGND
and DV
DD
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