AD5273BRJ100-R2 Analog Devices Inc, AD5273BRJ100-R2 Datasheet - Page 2

• Manufacturer Part Number: AD5273BRJ100-R2
• Description: IC DGTL POT 100K 64POS SOT23-8
• Manufacturer: Analog Devices Inc

Specifications of AD5273BRJ100-R2

• Rohs Status: RoHS non-compliant
• Taps: 64
• Resistance (ohms): 100K
• Number Of Circuits: 1
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-8
• Resistance In Ohms: 100K
• Number Of Elements: 1
• # Of Taps: 64
• Resistance (max): 100KOhm
• Power Supply Requirement: Single
• Interface Type: Serial (2-Wire/I2C)
• Single Supply Voltage (typ): 5V
• Dual Supply Voltage (typ): Not RequiredV
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• For Use With: AD5273EVAL - BOARD EVAL FOR AD5273
• Lead Free Status / RoHS Status: Not Compliant
• Other names: AD5273BRJ100-R2TR

AD5273
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 4
Absolute Maximum Ratings ............................................................ 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 13
REVISION HISTORY
10/10—Rev. G to Rev. H
Changes to OTP Power Supply Parameter in Table 1 .................. 4
Changes to V
Changes to One-Time Programming Section ............................ 13
Changes to Power Supply Considerations Section, Figure 38 .. 15
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
8/08—Rev. F to Rev. G
Changes to Power Supplies Parameter in Table 1 ......................... 3
Updated Fuse Blow Condition to 400 ms Throughout ............... 5
1/08—Rev. E to Rev. F
Changes to Table 1 ............................................................................ 4
Changes to Table 2 ............................................................................ 6
Changes to Table 3 ............................................................................ 7
Inserted Figure 28 ........................................................................... 12
Changes to One-Time Programming Section ............................ 13
Changes to Power Supply Considerations Section ..................... 15
Deleted Figure 35 ............................................................................ 15
Changes to Figure 36 ...................................................................... 15
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
ESD Caution .................................................................................. 6
One-Time Programming ........................................................... 13
Variable Resistance and Voltage for Rheostat Mode ............. 14
Variable Resistance and Voltage for Potentiometer Mode .... 14
ESD Protection ........................................................................... 15
Terminal Voltage Operating Range .......................................... 15
Power-Up/Power-Down Sequences ......................................... 15
DD
Pin Description in Table 3................................... 7
Rev. H | Page 2 of 24
Controlling the AD5273 ................................................................ 16
Applications Information .............................................................. 19
Evaluation Board ............................................................................ 21
Outline Dimensions ....................................................................... 22
1/05—Rev. D to Rev. E
Changes to Features .......................................................................... 1
Changes to Specifications ................................................................. 3
Changes to Table 3 ............................................................................. 6
Changes to Power Supply Considerations Section .................... 15
Changes to Figure 35 and Figure 37............................................. 15
Changes to DAC Section ............................................................... 19
Changes to Level Shift for Different Voltages
Operation Section........................................................................... 20
Deleted the Resistance Scaling Section ....................................... 20
Deleted the Resolution Enhancement Section ........................... 20
12/04—Rev. C to Rev. D
Updated Format .................................................................. Universal
Changes to Specifications ................................................................. 3
Changes to Theory of Operation Section.................................... 13
Changes to Power Supply Considerations Section .................... 15
Changes to Figure 35, Figure 36, and Figure 37 ......................... 15
11/03—Rev. B to Rev. C
Changes to SDA Bit Definitions and Descriptions .................... 10
Changes to One-Time Programming (OTP) Section................ 11
Changes to Table III ....................................................................... 11
Changes to Power Supply Considerations .................................. 13
Changes to Figure 8, Figure 9, and Figure 10 ............................. 13
Power Supply Considerations ................................................... 15
Software Programming ............................................................. 16
I
Controlling Two Devices on One Bus ..................................... 18
DAC .............................................................................................. 19
Programmable Voltage Source with Boosted Output ........... 19
Programmable Current Source ................................................ 19
Gain Control Compensation .................................................... 19
Programmable Low-Pass Filter ................................................ 20
Level Shift for Different Voltages Operation .......................... 20
RDAC Circuit Simulation Model ............................................. 20
Ordering Guide .......................................................................... 22
2
C Controller Programming .................................................... 17