5-353293-2 TE Connectivity, 5-353293-2 Datasheet - Page 7

• Manufacturer Part Number: 5-353293-2
• Description: MINI CT MT REC ASSY 2P BLUE
• Manufacturer: TE Connectivity

Specifications of 5-353293-2

• Product Type: Connector
• Connector Type: Connector Assembly
• Termination Method To Wire/cable: IDC
• Sealed: No
• Ul File Number: E28476
• Csa File Number: LR 7189-133
• Contact - Rated Current (a): 2
• Operating Voltage Reference: AC/DC, AC, DC
• Operating Voltage (vac): 50
• Operating Voltage (vdc): 50
• Wire/cable Size (awg): 26 – 28
• Profile Height (y-axis) (mm [in]): 6.00 [0.236]
• Number Of Positions: 2
• Number Of Rows: 1
• Centerline (mm [in]): 1.50 [0.059]
• Mating Retention: With
• Length (x-axis) (mm [in]): 4.50 [0.1772]
• Width (z-axis) (mm [in]): 3.60 [0.141]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Pre-Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.2 [7.87]
• Contact Design: Dual Beam
• Mating Alignment: With
• Housing Color: Blue
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Operating Temperature (°c [°f]): -30 – +105 [-22 – +221]
• Applies To: Wire/Cable
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.80 – 0.95 [0.030 – 0.037]
• Application Use: Wire-to-Board, Wire-to-Board / Wire-to-Wire / Wire-to-Panel, Wire-to-Panel, Wire-to-Wire
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Bag, Box

ASHL-0005- ES REV B
3.8.17 Resistance to Soldering
3.8.18 Thermal Shock
3.8.19 Humidity, Steady State
3.8.20 Humidity-Temperature
3.8.21 Salt Spray
Para
Heat
Cycling
Test Items
AMP Shanghai Ltd.
Tyco Electronics
No physical damege shall
occur.
Environmental Requirements
20 mΩ Max. (Final)
Insulation resistance
100 MΩ Min.(Final)
Termination resistance
20 mΩ Max. (Final)
Insulation resistance
100 MΩ Min.(final)
Termination resistance
20 mΩ Max. (Final)
20 mΩ Max. (Final)
Requirements
Fig. 2 (To be continued)
7 of 17
PAGE
Document No.
108-5525
Flow Soldering
Test connector on PCB.
Solder Temerature : 260 ± 5 °C
Immersion Duration : 10 ± 1 sec.
Reflow Soldering
Reflow Soldering by next
conditions.
Preheat:100～ 150℃ 60sec. Min.
Heating:210
Peak Temperature:240
(Measured at housing surface)
Manual Soldering
Temperature:350 ± 10 ℃
for 3+1 -0 Seconds.
To be no damage by the top of iron.
at soldering tynes.
Mated connector
－ 55 °C / 30 min.,+85 °C / 30 min.
Making this a cycle, repeat
500cycles. IEC 68-2-14
Mated connector,90～ 95 %R.H.
40 °C,500 hours
IEC 68-2-3
Mated connector, 25～ 65 °C,
90～ 95 % R.H. 10 cycles
Cold shock － 10 °C performed
IEC 68-2-38
Subject mated 35 ± 2 ℃ connectors
to 5 ± 1 % salt concentration for 48
hours :
Aften test,ninse the samples with
waten and recondition the room
temperature for hour.
IEC 68-2-11
℃
Procedures
Min.
30sec. Max.
℃
Max.
REV
A
LOC
ES