LTC1275ACSW Linear Technology, LTC1275ACSW Datasheet - Page 15

• Manufacturer Part Number: LTC1275ACSW
• Description: IC A/D CONV 12BIT SAMPLNG 24SOIC
• Manufacturer: Linear Technology

Specifications of LTC1275ACSW

• Number Of Bits: 12
• Sampling Rate (per Second): 300k
• Data Interface: Parallel
• Number Of Converters: 1
• Power Dissipation (max): 75mW
• Voltage Supply Source: Dual ±
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.300", 7.50mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

A
error voltage in series with the input signal, attention
should be paid to reducing the ground circuit impedances
as much as possible.
A single point analog ground plane separate from the logic
system ground should be established at Pin 3 (AGND) or
as close as possible to the ADC, as shown in Figure 11. Pin
12 (DGND) and all other analog grounds should be con-
nected to this single analog ground point. No other digital
grounds should be connected to this analog ground point.
Low impedance analog and digital power supply common
returns are essential to low noise operation of the ADC and
the width for these traces should be as wide as possible.
In applications where the ADC data outputs and control
signals are connected to a continuously active micropro-
cessor bus, it is possible to get errors in conversion
results. These errors are due to feedthrough from the
microprocessor to the ADC. The problem can be elimi-
nated by forcing the microprocessor into a WAIT state
during conversion or by using three-state buffers to iso-
late the ADC data bus.
DIGITAL INTERFACE
The ADCs are designed to interface with microprocessors
as a memory mapped device. The CS and RD control
inputs are common to all peripheral memory interfacing.
The HBEN input serves as a data byte select for 8-bit
processors and is normally either connected to the micro-
processor address bus or grounded.
PPLICATI
O
CIRCUITRY
U
ANALOG
S
INPUT
I FOR ATIO
U
+
–
1
A
IN
W
AGND
3
Figure 11. Power Supply Grounding Practice
ANALOG GROUND PLANE
10µF
V
U
REF
2
0.1µF
LTC1273
10µF
HBEN
Internal Clock
These ADCs have an internal clock that eliminates the need
for synchronization between an external clock and the CS
and RD signals found in other ADCs. The internal clock is
factory trimmed to achieve a typical conversion time of
2.45µs, and a maximum conversion time over the full
operating temperature range of 2.7µs. No external adjust-
ments are required and, with the guaranteed maximum
acquisition time of 600ns, throughput performance of
300ksps is assured.
Timing and Control
Conversion start and data read operations are controlled
by three digital inputs: HBEN, CS and RD. Figure 12 shows
the logic structure associated with these inputs. The three
signals are internally gated so that a logic “0” is required
RD
Figure 12. Internal Logic for Control Inputs CS, RD and HBEN
CS
V
DD
24
19
20
21
*
0.1µF
D11....D0/8 ARE THE ADC DATA OUTPUT PINS
DB11....DB0 ARE THE 12-BIT CONVERSION RESULTS
LTC1273/75/76
DGND
12
GROUND CONNECTION
TO DIGITAL CIRCUITRY
LTC1275/LTC1276
ACTIVE HIGH
ACTIVE HIGH
DIGITAL
SYSTEM
D
LTC1273/75/76 • F11
CLEAR
FLOP
FLIP
Q
ENABLE THREE-STATE OUTPUTS
D11....D0/8 = DB11....DB0
ENABLE THREE-STATE OUTPUTS
D11....D8 = DB11....DB8
D7....D4 = LOW
D3/11....D0/8 = DB11....DB8
BUSY
LTC1273
CONVERSION
START (RISING
EDGE TRIGGER)
LTC1273/75/76 • F12
15
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