LTC2351HUH-12#PBF Linear Technology, LTC2351HUH-12#PBF Datasheet - Page 19

• Manufacturer Part Number: LTC2351HUH-12#PBF
• Description: IC ADC 12BIT 1.5MSPS 32-QFN
• Manufacturer: Linear Technology

Specifications of LTC2351HUH-12#PBF

• Number Of Bits: 12
• Sampling Rate (per Second): 1.5M
• Data Interface: Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 16.5mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-WFQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

APPLICATIONS INFORMATION
The buffered serial port in the TMS320C54x has direct
access to a 2kB segment of memory. The ADC’s serial
data can be collected in two alternating 1kB segments,
in real time, at the full 1.5Msps conversion rate of the
LTC2351-12. The DSP assembly code sets frame sync
mode at the BFSR pin to accept an external positive going
pulse and the serial clock at the BCLKR pin to accept an
external positive edge clock. Buffers near the LTC2351-12
may be added to drive long tracks to the DSP to prevent
PACKAGE DESCRIPTION
5.50 ±0.05
4.10 ±0.05
(4 SIDES)
3.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PIN 1
TOP MARK
(NOTE 6)
3.45 ± 0.05
5.00 ± 0.10
(4 SIDES)
3.45 ± 0.05
32-Lead Plastic QFN (5mm × 5mm)
0.50 BSC
0.25 ± 0.05
(Reference LTC DWG # 05-08-1693)
0.70 ±0.05
PACKAGE OUTLINE
UH Package
0.75 ± 0.05
corruption of the signal to LTC2351-12. This confi guration
is adequate to traverse a typical system board, but source
resistors at the buffer outputs and termination resistors
at the DSP , may be needed to match the characteristic
impedance of very long transmission lines. If you need
to terminate the SDO transmission line, buffer it fi rst with
one or two 74ACxx gates. The TTL threshold inputs of the
DSP port respond properly to the 3V swing used with the
LTC2351-12.
(4-SIDES)
3.50 REF
0.00 – 0.05
0.200 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 ± 0.10
TYP
3.45 ± 0.10
31
0.50 BSC
0.25 ± 0.05
32
LTC2351-12
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 ± 0.10
19
235112fa