PCF2123TS/1,118 NXP Semiconductors, PCF2123TS/1,118 Datasheet - Page 48

• Manufacturer Part Number: PCF2123TS/1,118
• Description: IC SPI RTC/CALENDAR 14TSSOP
• Manufacturer: NXP Semiconductors
• Type: Clock/Calendar/Alarmr

Specifications of PCF2123TS/1,118

• Package / Case: 14-TSSOP
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 1.1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Function: Clock/Calendar
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.1 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Rtc Bus Interface: Serial (3-Wire, SPI)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4534-2; 935286384118; PCF2123TS/1-T

NXP Semiconductors
16. Bare die outline
Fig 33. Bare die outline PCF2123U/10 of PCF2123U/5GA/1 and PCF2123U/10AA/1 (for dimensions see
PCF2123
Product data sheet
Wire bond die; 12 bonding pads
PCF2123U/10
VERSION
OUTLINE
10
11
12
7
8
9
Table 46.
Original dimensions are in mm.
[1]
[2]
[3]
[4]
Unit (mm) A
PCF2123U/5GA/1
nom
PCF2123U/10AA/1
nom
IEC
x
Nominal die thickness. Compare with wafer thickness given in
Dimension includes saw lane.
P
P
1
2
0
and P
and P
0
y
e
D
D
Dimensions of PCF2123U/10
3
4
0.20
0.20
: pad size.
: passivation opening.
[1]
JEDEC
All information provided in this document is subject to legal disclaimers.
6
5
4
3
2
1
X
E
REFERENCES
D
1.492
1.492
[2]
Rev. 5 — 27 April 2011
JEITA
E
1.449
1.449
[2]
A
0
scale
e
1.296
1.296
D
1 mm
P
0.09
0.09
1
[3]
Table
PROJECTION
P
P
EUROPEAN
detail X
2
1
SPI Real time clock/calendar
50.
P
0.081
0.081
2
[4]
P
4
P
3
PCF2123
P
0.09
0.09
© NXP B.V. 2011. All rights reserved.
3
[3]
ISSUE DATE
08-07-24
11-04-06
PCF2123U/10
Table
P
0.081
0.081
4
46)
[4]
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