SI5356A-A-GM Silicon Laboratories Inc, SI5356A-A-GM Datasheet - Page 23

• Manufacturer Part Number: SI5356A-A-GM
• Description: IC CLK GENERATOR 200MHZ 24-QFN
• Manufacturer: Silicon Laboratories Inc

Specifications of SI5356A-A-GM

• Package / Case: 24-QFN
• Pll: Yes
• Input: CMOS, Crystal
• Output: CMOS
• Number Of Circuits: 1
• Ratio - Input:output: 2:8
• Differential - Input:output: No/No
• Frequency - Max: 200MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 1.71 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Frequency-max: *
• Max Input Freq: 200 MHz
• Supply Voltage (max): 3.3 V
• Supply Voltage (min): 1.8 V
• Max Output Freq: 200 MHz
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1750 - EVALUATION BOARD FOR SI5356
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1749-5

8. Recommended PCB Layout
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. Connect the center ground pad to a ground plane with no less than five vias. These 5 vias should have a length of no
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad.
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
more than 20 mils to the ground plane. Via drill size should be no smaller than 10 mils. A longer distance to the ground
plane is allowed if more vias are used to keep the inductance from increasing.
to be 60 µm minimum, all the way around the pad.
paste release.
Dimension
P1
P2
X1
Y1
C1
C2
E
Table 10. PCB Land Pattern
2.50
2.50
0.20
0.75
Min
Preliminary Rev. 0.3
3.90
3.90
0.50
Nom
2.55
2.55
0.25
0.80
Max
2.60
2.60
0.30
0.85
Si5356
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