LV810FIT IDT, Integrated Device Technology Inc, LV810FIT Datasheet - Page 3

• Manufacturer Part Number: LV810FIT
• Description: IC BUFFER/CLOCK DRIVER 20-SSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Fanout Buffer (Distribution)r

Specifications of LV810FIT

• Number Of Circuits: 1
• Ratio - Input:output: 1:10
• Differential - Input:output: No/No
• Input: Clock
• Output: TTL
• Frequency - Max: 133MHz
• Voltage - Supply: 1.425 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP
• Frequency-max: 133MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

External Components
The ICSLV810 requires a minimum number of external
components for proper operation.
Decoupling Capacitors
Decoupling capacitors of 0.01µF must be connected
between VDD and GND, as close to these pins as possible.
For optimum device performance, the decoupling capacitors
should be mounted on the component side of the PCB.
Avoid the use of vias in the decoupling circuit.
Series Termination Resistor
When the PCB trace between the clock outputs and the
loads are over 1 inch, series termination should be used. To
series terminate a 50 trace (a commonly used trace
impedance) place a 33 resistor in series with the clock line,
Absolute Maximum Ratings
Recommended Operation Conditions
IDT™ / ICS™ BUFFER/CLOCK DRIVER
ICSLV810
BUFFER/CLOCK DRIVER
Stresses above the ratings listed below can cause permanent damage to the ICSLV810. These ratings, which are
standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Supply Voltage, VDD MAX
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured with respect to GND), VDDA
Power Supply Voltage (measured with respect to GND), VDDB
Power Supply Voltage (measured with respect to GND), VDDC
Item
3
as close to the clock output pin as possible. The nominal
impedance of the clock output is 20 .
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1) The 0.01µF decoupling capacitors should be mounted on
the component side of the board as close to the VDD pins
as possible. No vias should be used between the
decoupling capacitors and VDD pins. The PCB trace to VDD
pin should be kept as short as possible, as should the PCB
trace to the ground via.
2) To minimize EMI the 33 series termination resistor, if
needed, should be placed close to the clock output.
7 V
-0.5 V to VDDA + 1.2 V
-40 to +85 C
-65 to +150 C
125 C
260 C
1.425
1.425
1.425
Min.
-40
Typ.
Rating
2.625
2.625
2.625
Max.
+85
ICSLV810
FAN OUT BUFFER
Units
V
V
V
C
REV H 051310