TSX5070FN STMicroelectronics, TSX5070FN Datasheet - Page 14

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TSX5070FN

Manufacturer Part Number
TSX5070FN
Description
Manufacturer
STMicroelectronics
Type
PCMr
Datasheet

Specifications of TSX5070FN

Number Of Channels
1
Gain Control
Programmable
Number Of Adc's
1
Number Of Dac's
1
Package Type
PLCC
Operating Supply Voltage (typ)
±5V
Number Of Adc Inputs
1
Number Of Dac Outputs
1
Operating Supply Voltage (max)
±5.25V
Operating Supply Voltage (min)
±4.75V
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant

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TS5070 - TS5071
APPLICATION INFORMATION
Figure 2 shows a typical application of the TS5070
together with a transformer SLIC.
The design of the transformer is greatly simplified
due to the on-chip hybrid balance cancellation filter.
Only one single secondary winding is required (see
application note AN.091 - Designing a subscriber
line card module using the TS5070/COMBO IIG).
Figures 3 and 4 show an arrangement with SGS-
Thomson monolithic SLICS.
POWER SUPPLIES
While the pins of the TS5070 and TS5071/COMBO
IIG devices are well protected against electrical
misuse, it is recommended that the standard
CMOS practice of applying GND to the device be-
14/32
fore any other connections are made should always
be followed. In applications where the printed circuit
card may be plugged into a hot socket with power
and clocks already present, an extra long ground
pin on the connector should be used and a Schottky
diode connected between V
mize noise sources all ground connections to each
device should meet at a common point as close as
possible to the GND pin in order to prevent the in-
teraction of ground return currents flowing through
a common bus impedance. Power supply decou-
pling capacitors of 0.1 F should be connected from
this common device ground point to V
as close to the device pins as possible. V
should also be decoupled with low effective series
resis-tance capacitors of at least 10 F located near
the card edge connector.
SS
and GND. To mini-
CC
CC
and V
and V
SS
SS

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