MT47H32M8BP-5E IT:B TR Micron Technology Inc, MT47H32M8BP-5E IT:B TR Datasheet - Page 106

MT47H32M8BP-5E IT:B TR

Manufacturer Part Number
MT47H32M8BP-5E IT:B TR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H32M8BP-5E IT:B TR

Organization
32Mx8
Density
256Mb
Address Bus
15b
Access Time (max)
600ps
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
125mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Figure 63: Bank Write – with Auto Precharge
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
DQS, DQS#
Command
Bank select
Address
DQ 6
CK#
CKE
A10
DM
CK
NOP 1
T0
Notes:
Bank x
ACT
RA
RA
T1
t CK
1. NOP commands are shown for ease of illustration; other commands may be valid at
2. BL = 4 and AL = 0 in the case shown.
3. Enable auto precharge.
4. WR is programmed via MR9–MR11 and is calculated by dividing
5. Subsequent rising DQS signals must align to the clock within
6. DI n = data-in from column n; subsequent elements are applied in the programmed order.
7.
8.
these times.
rounding up to the next integer value.
t
t
DSH is applicable during
DSS is applicable during
t RCD
NOP 1
T2
t CH
t CL
WRITE 2
Bank x
Col n
3
T3
WL ± t DQSS (NOM)
WL = 2
NOP 1
t
106
T4
t
DQSS (MAX) and is referenced from CK T6 or T7.
DQSS (MIN) and is referenced from CK T5 or T6.
t WPRE
NOP 1
T5
DI
Micron Technology, Inc. reserves the right to change products or specifications without notice.
n
t RAS
256Mb: x4, x8, x16 DDR2 SDRAM
T5n
t DQSL t DQSH t WPST
NOP 1
5
T6
T6n
Transitioning Data
NOP 1
T7
©2003 Micron Technology, Inc. All rights reserved.
t
DQSS.
t
WR (in ns) by
NOP 1
WR 4
T8
Don’t Care
NOP 1
t
T9
CK and
WRITE
t RP

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