MT47H64M16HR-3 L:E TR Micron Technology Inc, MT47H64M16HR-3 L:E TR Datasheet - Page 112

• Manufacturer Part Number: MT47H64M16HR-3 L:E TR
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M16HR-3 L:E TR

• Organization: 64Mx16
• Density: 1Gb
• Address Bus: 16b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 220mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Figure 62: Bank Write – Without Auto Precharge
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Bank select
DQS, DQS#
Command
Address
DQ 6
CK#
CKE
A10
DM
CK
NOP 1
T0
Notes:
Bank x
ACT
RA
RA
T1
1. NOP commands are shown for ease of illustration; other commands may be valid at
2. BL = 4 and AL = 0 in the case shown.
3. Disable auto precharge.
4. “Don’t Care” if A10 is HIGH at T9.
5. Subsequent rising DQS signals must align to the clock within
6. DI n = data-in for column n; subsequent elements are applied in the programmed order.
7.
8.
t CK
these times.
t
t
DSH is applicable during
DSS is applicable during
t RCD
NOP 1
T2
t CH
t CL
WRITE 2
Bank x
Col n
3
T3
WL ± t DQSS (NOM)
WL = 2
NOP 1
t
112
T4
t
DQSS (MAX) and is referenced from CK T6 or T7.
DQSS (MIN) and is referenced from CK T5 or T6.
t WPRE
NOP 1
T5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
DI
n
T5n
t DQSL t DQSH t WPST
t RAS
1Gb: x4, x8, x16 DDR2 SDRAM
NOP 1
5
T6
T6n
Transitioning Data
NOP 1
T7
© 2004 Micron Technology, Inc. All rights reserved.
t
DQSS.
t WR
NOP 1
T8
One bank
All banks
Don’t Care
Bank x 4
T9
PRE
WRITE
t RP