TDA4856/V6,112 NXP Semiconductors, TDA4856/V6,112 Datasheet - Page 19

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TDA4856/V6,112

Manufacturer Part Number
TDA4856/V6,112
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA4856/V6,112

Lead Free Status / RoHS Status
Compliant
Philips Semiconductors
2003 Sep 30
H
V
V
I
I
V
Output stage for line driver pulses: pin HDRV
O
V
I
A
t
X-ray protection: pin XRAY
V
t
R
XRAY
V
V
R
pos(HFLB)
neg(HFLB)
LO(HDRV)
HDRV(OFF)
W(XRAY)(min)
pos(HFLB)
neg(HFLB)
sl(HFLB)
sat(HDRV)
UTOMATIC VARIATION OF DUTY CYCLE
XRAY(sl)
CC(XRAY)(min)
CC(XRAY)(max)
ORIZONTAL FLYBACK INPUT
i(XRAY)
XSEL
I
PC monitors
PEN
2
SYMBOL
C-bus autosync deflection controller for
-
rst
COLLECTOR OUTPUT STAGE
/t
H
positive clamping level
negative clamping level
positive clamping current
negative clamping current
slicing level
saturation voltage
output leakage current
relative t
output; measured at
V
is modulated by the relation
I
slicing voltage level for latch
minimum width of trigger pulse
input resistance at XRAY
(pin 2)
reset of X-ray latch
minimum supply voltage for
correct function of the X-ray
latch
maximum supply voltage for
reset of the X-ray latch
external resistor at pin 9
HREF
HDRV
/I
VREF
= 3 V; HDRV duty cycle
:
PIN
OFF
PARAMETER
HFLB
time of HDRV
I
I
I
I
V
I
f
I
f
I
f
V
V
standby mode
pin 9 open-circuit or
connected to GND
pin 9 connected to V
R
pin 9 connected to V
R
pin 9 connected to V
R
no reset via I
i(HFLB)
i(HFLB)
o(HDRV)
o(HDRV)
o(HDRV)
H
o(HDRV)
H
o(HDRV)
H
HDRV
XRAY
XRAY
XSEL
XSEL
XSEL
= 31.45 kHz; see Fig.16
= 58 kHz; see Fig.16
= 110 kHz; see Fig.16
19
CONDITIONS
< 6.38 V + V
> 6.38 V + V
= 16 V
= 5 mA
= 1 mA
= 20 mA
= 60 mA
= 20 mA;
= 20 mA;
= 20 mA;
2
C-bus
BE
BE
CC
CC
CC
via
via
via
42
45.5
49
6.22
500
set control bit SOFTST via I
switch off V
2
56
MIN.
5.5
2.8
45
48.5
52
6.39
5
5
0.75
TYP.
CC
, then re-apply V
Product specification
6
0.3
0.8
10
48
51.5
55
6.56
30
4
130
TDA4856
MAX.
2
2
V
V
mA
mA
V
V
V
%
%
%
V
k
k
k
V
V
k
C-bus
UNIT
A
s
CC

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