TIM7785-30SL Toshiba, TIM7785-30SL Datasheet

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TIM7785-30SL

Manufacturer Part Number
TIM7785-30SL
Description
Manufacturer
Toshiba
Datasheet

Specifications of TIM7785-30SL

Configuration
Single
Gate-source Voltage (max)
5V
Drain-source Volt (max)
15V
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TIM7785-30SL
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 ° C )
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
Gain Flatness
Power Added Efficiency
3rd Order Intermodulation
Distortion
Drain Current
Channel Temperature Rise
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown
Voltage
Thermal Resistance
Recommended Gate Resistance(Rg): 28 Ω (Max.)
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is presented only as a guide for the applications of our products. No responsibility is
FEATURES
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
HIGH POWER
LOW INTERMODULATION DISTORTION
IM3=-45 dBc at Po= 34.5 dBm,
Single Carrier Level
P1dB=45.0dBm at 7.7GHz to 8.5GHz
CHARACTERISTICS
CHARACTERISTICS
SYMBOL
SYMBOL
R
V
V
G
P
ΔTch
I
I
η
I
th(c-c)
IM
GSoff
DS1
DS2
DSS
ΔG
gm
GSO
1dB
1dB
add
3
V
I
V
I
V
V
I
Channel to Case
(VDS X IDS + Pin – P1dB)
DS
DS
GS
DS
DS
DS
GS
(Single Carrier Level)
f
= 10A
= 100mA
= -350μA
Two-Tone Test
= 7.7 to 8.5GHz
CONDITIONS
CONDITIONS
= 3V
=
=
= 0V
Po=34.5dBm
V
3V
3V
X Rth(c-c)
DS
HIGH GAIN
G1dB=6.0dB at 7.7GHz to 8.5GHz
BROAD BAND INTERNALLY MATCHED FET
HERMETICALLY SEALED PACKAGE
MICROWAVE POWER GaAs FET
=10
V
TIM7785-30SL
UNIT
UNIT
° C/W
dBm
dBc
mS
dB
dB
° C
%
A
A
V
A
V
MIN.
44.5
MIN.
-1.0
-42
5.0
-5
Rev. Jun. 2006
TYP. MAX.
45.0
TYP. MAX.
6300
-45
6.0
7.0
7.0
-2.5
34
1.0
18
±0.8
100
8.0
8.0
-4.0
1.3

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TIM7785-30SL Summary of contents

Page 1

... SYMBOL CONDITIONS 10A GSoff 100mA DSS -350μA GSO GS R Channel to Case th(c-c) TIM7785-30SL UNIT MIN. TYP. MAX. dBm 44.5 45.0 dB 5.0 6.0 ⎯ A 7.0 ⎯ ⎯ dB ⎯ dBc -42 -45 ⎯ A 7.0 ° C ⎯ ⎯ UNIT MIN. TYP. MAX. ⎯ mS 6300 V -1 ...

Page 2

... ABSOLUTE MAXIMUM RATINGS ( Ta= 25 ° CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 ° C) Channel Temperature Storage PACKAGE OUTLINE (2-16G1B) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C. TIM7785-30SL SYMBOL ...

Page 3

... RF PERFORMANCE Output Power (Pout) vs. Frequency V =10V DS ≅7. Pin=39.0dBm Output Power(Pout) vs. Input Power(Pin) freq.=8.5GHz V =10V DS ≅7. TIM7785-30SL 7.7 7.9 8.1 8.3 Frequency(GHz) Pout ηadd 36 38 Pin(dBm ...

Page 4

... Power Dissipation(PT) vs. Case Temperature(Tc) 120 100 IM3 vs. Output Power Characteristics -10 V =10V DS ≅7. freq.=8.5GHz -20 Δf=5MHz -30 -40 -50 - Pout(dBm) @Single carrier level TIM7785-30SL 80 120 Tc( ° 200 160 38 40 ...

Page 5

... No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. MICROWAVE POWER GaAs FET TIM7785-25UL BROAD BAND INTERNALLY MATCHED FET HERMETICALLY SEALED PACKAGE SYMBOL ...

Page 6

... ABSOLUTE MAXIMUM RATINGS ( Ta= 25 ° CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 ° C) Channel Temperature Storage PACKAGE OUTLINE (2-16G1B) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C. TIM7785-25UL SYMBOL ...

Page 7

... RF PERFORMANCE 47 VDS= 10V ≅ IDS 6.8A 46 Pin= 36.0dBm 7.4 7 8.1GHz VDS= 10V 4 5 ≅ IDS 6. TIM7785-25UL Output Power vs. Frequency 7.8 8 8.2 Frequency (GHz) Output Power vs. Input Power Po ηadd Pin (dBm) 3 8.4 8.6 8 ...

Page 8

... TIM7785-25UL Power Dissipation vs. Case Temperature ℃ ) IM3 vs. Output Power Characteristics -20 VDS= 10V ≅ IDS 6.8A f= 8.1GHz Δ f= 5MHz -30 -40 -50 - Po(dBm), Single Carrier Level ...

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