BAP55LX T/R NXP Semiconductors, BAP55LX T/R Datasheet
BAP55LX T/R
Specifications of BAP55LX T/R
Related parts for BAP55LX T/R
BAP55LX T/R Summary of contents
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BAP55LX Silicon PIN diode Rev. 2 — 16 December 2010 1. Product profile 1.1 General description Planar PIN diode in a SOD882T leadless ultra small plastic SMD package. 1.2 Features and benefits High speed switching for RF signals ...
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... NXP Semiconductors 4. Marking Table 3. Type number BAP55LX 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg Thermal characteristics Table 5. Symbol R th(j-sp) 7. Characteristics Table 6. Characteristics unless otherwise specified. amb Symbol Parameter V forward voltage F I reverse current ...
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... NXP Semiconductors Table 6. Characteristics …continued unless otherwise specified. amb Symbol Parameter ISL isolation L insertion loss ins L insertion loss ins L insertion loss ins L insertion loss ins charge carrier life time L L series inductance S BAP55LX Product data sheet Conditions see Figure 3 ...
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... NXP Semiconductors 400 C d (fF) 300 200 100 MHz Fig 1. Diode capacitance as a function of reverse voltage; typical values 0 ISL (dB) −10 −20 −30 −40 0 1000 = 25 C T amb Diode zero biased and inserted in series with a 50 stripline circuit Fig 3. Isolation of the diode as a function of frequency ...
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... NXP Semiconductors 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0 (1) DIMENSIONS (mm are the original dimensions UNIT max 0.40 0.55 0.65 mm 0.04 0.36 0.45 0.55 Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD882T Fig 5. Package outline SOD882T ...
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... NXP Semiconductors 9. Abbreviations Table 7. Acronym PIN SMD RF 10. Revision history Table 8. Revision history Document ID Release date BAP55LX v.2 20101216 • Modifications: Table BAP55LX v.1 20070730 BAP55LX Product data sheet Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency Data sheet status Product data sheet 6: added minimum value for “ ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Legal information 11.1 Data sheet status ...