MPC8349EVVAJFB Freescale, MPC8349EVVAJFB Datasheet - Page 86

MPC8349EVVAJFB

Manufacturer Part Number
MPC8349EVVAJFB
Description
Manufacturer
Freescale
Datasheet

Specifications of MPC8349EVVAJFB

Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
533MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
TBGA
Lead Free Status / RoHS Status
Compliant

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Document Revision History
86
Number
Rev.
3
2
1
0
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
11/2006
8/2006
4/2006
3/2006
Date
Initial public release.
• Updated note in introduction.
• In the features list in Section 1, “Overview,” updated DDR data rate to show 400 MHz for DDR2
• In Section 23, “Ordering Information,” replicated note from document introduction.
• Changed all references to revision 2.0 silicon to revision 3.0 silicon.
• Changed VIH minimum value in Table 40, “JTAG Interface DC Electrical Characteristics,” to
• In Table 44, “PCI DC Electrical Characteristics,” changed high-level input voltage values to min
• Updated DDR2 I/O power values in Table 5, “MPC8347EA Typical I/O Power Dissipation.”
• In Table 66, “Suggested PLL Configurations,” deleted reference-number rows 902 and 703.
• Removed Table 20, “Timing Parameters for DDR2-400.”
• Changed ADDR/CMD to ADDR/CMD/MODT in Table 9, “DDR and DDR2 SDRAM Output AC
• Changed Min and Max values for V
• In Table 55, “MPC8349EA (TBGA) Pinout Listing,” and Table 52, “MPC8347EA (PBGA) Pinout
• Table 55, “MPC8349EA (TBGA) Pinout Listing,” in row AVDD3 changed power supply from
for TBGA parts for silicon 3.x and 400 MHz for DDR2 for TBGA parts for silicon 3.x.
OV
= 2 and max = OV
Timing Specifications,” rows 2 and 3, and in Figure 2, “DDR SDRAM Output Timing Diagram.
Characteristics.”
Listing,” modified rows for MDICO and MDIC1 signals and added note ‘It is recommended that
MDICO be tied to GRD using an 18 Ω resistor and MCIC1 be tied to DDR power using an 18 Ω
resistor.’
“AVDD3” to ‘—.’
DD
Table 68. Document Revision History (continued)
– 0.3.
DD
+ 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8.
Substantive Change(s)
IH
and VIL in Table 40Table 44,“PCI DC Electrical
Freescale Semiconductor

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