MPC8349EVVAJFB Freescale, MPC8349EVVAJFB Datasheet - Page 55

• Manufacturer Part Number: MPC8349EVVAJFB
• Manufacturer: Freescale

Specifications of MPC8349EVVAJFB

• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 533MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• Lead Free Status / RoHS Status: Compliant

18.2
Figure 39
672-TBGA package.
Freescale Semiconductor
Figure 39. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8349EA TBGA
Mechanical Dimensions for the MPC8349EA TBGA
shows the mechanical dimensions and bottom surface nomenclature for the MPC8349EA,
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement must exclude any effect of mark on top surface of package.
Package and Pin Listings
55