TLE7230G-L Infineon Technologies, TLE7230G-L Datasheet

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TLE7230G-L

Manufacturer Part Number
TLE7230G-L
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLE7230G-L

Switch Type
Low Side
Power Switch Family
TLE7230G
Input Voltage
-0.3 to 6V
Power Switch On Resistance
800mOhm
Output Current
1A
Number Of Outputs
8
Mounting
Surface Mount
Supply Current
1mA
Package Type
DSO
Operating Temperature (min)
-40C
Operating Temperature (max)
150C
Operating Temperature Classification
Automotive
Pin Count
24
Lead Free Status / RoHS Status
Compliant
Smart Octal Low-Side Switch
Features
♦ Full Protection
♦ Low Quiescent Current< 10µA
♦ 16 bit SPI (for Daisychain)
♦ Direct Parallel Control of Four Channels
♦ PWM input (demux)
♦ Parallel Inputs High or Low Active Programmable
♦ Programmable functions
♦ General Fault Flag
♦ Digital Ports Compatible to 5V and 3,3 V Micro Controllers
♦ Electostatic Discharge (ESD) Protection
♦ Full reverse current capability without latchup or loss of function
General description
Octal
Smart
(SPT) with a Serial Peripheral
Interface (SPI) and eight open
drain DMOS output stages.
The TLE 7230 R/G is pro-
tected by embedded protec-
tion functions and designed for
automotive applications.
V1.1
Overload
Overtemperature
Overvoltage
Boollean operation
Overload behavior
Overtemperature behavior
Switching time
Low-Side
Power
Technology
Switch
in
SCLK
SI
SO
CS
IN2
IN4
IN1
IN3
T a r g e t D a t a s h e e t T L E 7 2 3 0 R / G
GND
as Ch. 1
as Ch. 1
as Ch. 1
Serial Interface
Detailed Block Diagram
VS
PRG
Product Summary
Page
Supply voltage
Drain source clamping voltage
On resistance
SPI
RESET
16
1
LOGIC
8
VS
Output Control
1
Buffer
FAULT
GND
4
VDO
8
Power P-DSO 36
P-DSO-24
Output Stage
V
V
R
Protection
Functions
S
DS(AZ)max
ON
12. Oct. 2003
4.5 – 5.5 V
60
0.8
V
OUT1
OUT8
BB
V

Related parts for TLE7230G-L

TLE7230G-L Summary of contents

Page 1

... Smart Octal Low-Side Switch Features ♦ Full Protection Overload Overtemperature Overvoltage ♦ Low Quiescent Current< 10µA ♦ 16 bit SPI (for Daisychain) ♦ Direct Parallel Control of Four Channels ♦ PWM input (demux) ♦ Parallel Inputs High or Low Active Programmable ♦ Programmable functions ...

Page 2

Power SO 36 package Pin Description Pin Symbol Function 1 GND Ground 2 NC not connected 3 NC not connected 4 OUT1 Output Channel 1 5 OUT2 Output Channel 2 6 IN1 Input Channel 1 7 IN2 Input Channel 2 ...

Page 3

SO 24 package (thermal enhanced) Pin Description Pin Symbol Function 1 CS Chip Select 2 IN Mappable input 3 OUT3 Output Channel 3 4 OUT4 Output Channel 4 5 GND Ground 6 GND Ground 7 GND Ground 8 GND Ground ...

Page 4

Maximum Ratings for T Parameter Supply Voltage Continuous Drain Source Voltage (OUT1...OUT8) Input Voltage, All Inputs and Data Lines Operating Temperature Range Storage Temperature Range Output Current per Channel (see el. characteristics) Reverse current per channel Output Clamping Energy (single ...

Page 5

... Input Pull Up Current (CS) 4. Digital Outputs (SO, Fault) SO High State Output Voltage SO Low State Output Voltage Output Tri-state Leakage Current Fault Output Low Voltage 1 For V < 4.5V the power stages are switched according the input signals and data bits or are definitely switched S off. V1 Symbol V S ...

Page 6

... Reset = (unless otherwise specified) 5. Diagnostic Functions Open Load Detection Voltage Output Pull Down Current Fault Delay Time Overload switch off delay time Short to Ground Detection Voltage Short to Ground Detection Current Overload Threshold Current Overtemperature Shutdown Threshold 2 Hysteresis 6. SPI-Timing (for ...

Page 7

... Channel Signal logic channel Switching speed / Slew rate: The switching speed / slew rate of all 8 channels can be configured by SPI for slow or fast switching speed (1:5) for each channel individually. Overtemperature Behavior: Each channel has an overtemperature sensor and is individually protected against overtemperature. ...

Page 8

... OFF. PRG pin itself is internally pulled up when it is not connected. Reset - If the reset pin logic low state, it clears the SPI shift register and switches all outputs OFF. An internal pull-up structure is provided on chip. Fault - There is a general fault pin (open drain) which shows a high to low transition as soon as an error occurs for any one of the eight channels. This fault indication can be used to gen- erate a µ ...

Page 9

... SPI will not accept the data in the shift register and the fault register will not be reset. SCLK - Serial Clock. The serial clock pin clocks the internal SPI shift register of the TLE7230G/R. The serial input (SI) accepts data into the input SPI shift register on the falling edge if while the serial output (SO) shifts diagnostic information out of the SPI shift register on the rising edge of serial clock ...

Page 10

... The data of the SI word will be written to the addressed register. No valid Commands : If the first 8 bit of the SI word contain no valid bit combination it will not lead to an reac- tion (register value change, switching channels, ...) of the IC. After Chip Select giong L H the diagnosis register will not be reset. ADDR ...

Page 11

... Reads back the state of the output (read only register) 0: DMOS off 1: DMOS on Serial Output Control Register (CTL) Sets the serial controll bits for switching the output stages. 0: Output off 1: Output on SPI Diagnostics: As soon as a fault occurs for longer than the fault filtering time, the fault information is latched into the diagnosis register (and the Fault pin will change from high to low state) ...

Page 12

CS will reset all diagnosis registers and restart the fault filtering time. In case of an invalid command the device will ignore the data bits and the diagnosis register will not be reset ...

Page 13

Figure 6: Serial Interface Timing Diagram CS 0 SCKH t lead SCLK Figure 7: Input Timing Diagram SO Valid Time Waveforms 0.7 V SCLK t valid ...

Page 14

P-DSO 36-12 TLE 7230 R V1 Ordering Code Page 14 12. ...

Page 15

P-DSO 24 TLE 7230 G V1 Ordering Code Page 15 12. Oct. 2003 ...

Page 16

... Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...

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