LE3100MICH S L8YC Intel, LE3100MICH S L8YC Datasheet - Page 99

• Manufacturer Part Number: LE3100MICH S L8YC
• Manufacturer: Intel

Specifications of LE3100MICH S L8YC

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Boxed Processor Specifications
Table 7-1.
Figure 7-6.
7.4
7.4.1
Datasheet
Fan Heatsink Power and Signal Specifications
1. Baseboard should pull this pin up to 5V with a resistor.
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.
Baseboard Power Header Placement Relative to Processor Socket
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by
the boxed processor.
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
Notes:
+12V: 12 volt fan power supply
IC:
SENSE: SENSE frequency
CONTROL
- Maximum fan steady-state current draw
- Average fan steady-state current draw
- Maximum fan start-up current draw
- Fan start-up current draw maximum
duration
C
Description
B
Boxed_Proc_PwrHeaderPlacement
11.4
Min
21
—
—
—
—
—
[4.33]
R110
Typ
1.2
0.5
2.2
1.0
25
12
2
Max
12.6
28
—
—
—
—
—
V
pulses per
revolution
Second
Unit
kHz
fan
A
A
A
Notes
2, 3
-
1
-
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