PNX8510HW/B1,557 NXP Semiconductors, PNX8510HW/B1,557 Datasheet - Page 90

• Manufacturer Part Number: PNX8510HW/B1,557
• Manufacturer: NXP Semiconductors

Specifications of PNX8510HW/B1,557

• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
15. Revision history
Table 50:
9397 750 12612
Product data
Rev Date
04
03
02
01
20040112
20030926
20011008
20010827
Revision history
CPCN
853-2300 27221
[3]
[4]
[5]
[6]
[7]
[8]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side,
the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the
heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar or manual soldering is suitable for PMFP packages.
Description
Upgraded to Product data (9397 750 12612)
Modifcations to:
Preliminary data (9397 750 09223). Major updates to docs by Hari Tadepalli of VLSI
IC Engineering as requested format upgrade to DVP template. More detail added to:
Luminance and Chrominance Processing, Macrovision™ and Programming Interface.
Supersedes initial version of 27 August 2001 (9397 750 08495). The format of this
document has been redesigned to comply with Philips Semiconductors’ new
presentation and information standard.
Preliminary release posted on BHS (DVI) Intranet web site
•
•
Section
Section
Rev. 04 – 12 January 2004
7.6: Remark amended
10.4: added
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
PNX8510/11
Analog companion chip
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