5962-8873504LA QP SEMICONDUCTOR, 5962-8873504LA Datasheet - Page 2

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5962-8873504LA

Manufacturer Part Number
5962-8873504LA
Description
Manufacturer
QP SEMICONDUCTOR
Datasheet

Specifications of 5962-8873504LA

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Part Number
Manufacturer
Quantity
Price
Part Number:
5962-8873504LA
Manufacturer:
CYP
Quantity:
2 769
DSCC FORM 2234
APR 97
accordance with MIL-PRF-38535, appendix A.
1/ Unless otherwise specified, all voltages are referenced to ground.
2/ Must withstand the added P
3/ Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
1.4 Recommended operating conditions.
Supply voltage range (V
DC voltage applied to outputs in high Z state ................................
DC program voltage (V
DC input voltage.............................................................................
Storage temperature range ............................................................
Power dissipation (P
Lead temperature (soldering, 10 seconds) ....................................
Junction temperature (T
Thermal resistance, junction-to-case (θ
Supply voltage range (V
Case operating temperature range (T
Device type
Outline letter
Device types 01 and 02...............................................................
Device types 03 and 04...............................................................
DEFENSE SUPPLY CENTER COLUMBUS
Drawing number
5962-88735
MICROCIRCUIT DRAWING
01
02
03
04
COLUMBUS, OHIO 43218-3990
K
L
3
STANDARD
D
) 2/..............................................................
PP
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N28
CC
J
CC
) 3/ .........................................................
):
D
Descriptive designator
) ...........................................................
) ...........................................................
Device type
(see 1.2.1)
due to short-circuit test; e.g., I
01
Generic number
7C245
7C245
7C245A
7C245A
C
) .......................................
JC
) .....................................
Case outline
(see 1.2.2)
L
OS
.
Terminals
2K X 8-bit registered PROM
2K X 8-bit registered PROM
2K X 8-bit registered PROM
2K X 8-bit registered PROM
24
24
28
SIZE
A
Circuit function
Lead finish
(see 1.2.3)
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
14.0 V dc
13.0 V dc
-3.0 V dc to +7.0 V dc
-65°C to +150°C
1.0 W
+300°C
+150°C
See MIL-STD-1835
+4.5 V dc to +5.5 V dc
-55°C to +125°C
A
REVISION LEVEL
Flat package
Dual-in-line package
Square leadless chip carrier
Package style
E
Access time
45 ns
35 ns
35 ns
25 ns
SHEET
5962-88735
2

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