MT28C64432W18AFW-F705P70 TWT Micron Technology Inc, MT28C64432W18AFW-F705P70 TWT Datasheet - Page 8

• Manufacturer Part Number: MT28C64432W18AFW-F705P70 TWT
• Manufacturer: Micron Technology Inc

Specifications of MT28C64432W18AFW-F705P70 TWT

• Operating Supply Voltage (max): 1.95V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Table 1:
NOTE:
09005aef80c9c807
MT28C64432W18A.fm - Rev. F Pub 2/04 EN
1. Tie this ball to V
2. Tie this ball to V
3. Do not use (DNU) for Flash asynchronous/page operation.
G2, G3, F3, G4, H5,
D8, E8, C2, A2, A3,
D7, A8, B8, C8, E7,
F5, H6, G7, F2, H3,
F4, H4, G5, F6, G6,
B1, E2, D2, E6, C7,
A4, B4, K1, K5, K8
F1, E1, D1, C1, A1,
B5, H1, J2, J3, J4
77-BALL FBGA
Flash discrete data sheet.
A5, A6, J6, K4
NUMBERS
B3, C3, D3
H8, J7, K3
D6, A7
K2, K6
H2
D4
D5
G1
H7
K7
E5
B6
E4
B2
E3
C5
C6
C4
B7
J1
J8
F7
J5
F8
G8
Ball Descriptions
SS
SS
for Flash asynchronous/page non-latched operation. For latched operation, please refer to the
or V
DQ0–DQ15
SYMBOL
F_WAIT#
F_ADV#
A0–A21
F_RST#
C_WE#
F_WE#
F_WP#
F_OE#
C_UB#
C_OE#
F_CLK
C_LB#
C_CE#
C_ZZ#
F_CE#
F_V
C_V
F_V
C_V
F_V
V
V
RFU
RFU
RFU
RFU
CC
NC
CC
SS
CC
Q
PP
CC
SS
SS
Q
for Flash asynchronous/page operation.
64Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
Output
Supply
Supply
Supply
Supply
Supply
Supply
Supply
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
TYPE
I/O
–
–
–
–
–
16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM
Addresses:
Flash: A0–A21.
CellularRAM: A0–A19 (16Mb).
CellularRAM: A0–A20 (32Mb).
CellularRAM: A0–A21 (64Mb).
Flash Chip Enable.
Flash Output Enable.
Flash Write Enable.
Flash Write Protect.
Flash Address Valid (burst operation only)
Flash Clock (burst operation only)
Flash Reset.
CellularRAM Lower Byte Control.
CellularRAM Upper Byte Control.
CellularRAM Write Enable.
CellularRAM Output Enable.
CellularRAM Chip Enable.
CellularRAM Deep Sleep Mode and Configuration Mode.
Flash/CellularRAM Data Input/Output.
Flash WAIT# (burst operation only)
page 9.
Flash Core Ground.
Flash V
Flash Core Power Supply.
CellularRAM Core Ground.
CellularRAM Core Power Supply.
Flash/CellularRAM I/O Supply.
Flash/CellularRAM I/O Ground.
No Connect. Not internally connected to the die.
Ball not Mounted. Reserved for Future Use (A23, A24, A25).
Reserved for Future Use (A22).
Reserved for Future Use (F_CE2#).
Reserved for Future Use (F_OE2#).
PP
.
8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DESCRIPTIONS
2
.
3
. See “WAIT Ball Operation” on
1
.
©2003 Micron Technology. Inc. All rights reserved.