MT28C64432W18AFW-F705P70 TWT Micron Technology Inc, MT28C64432W18AFW-F705P70 TWT Datasheet - Page 12

• Manufacturer Part Number: MT28C64432W18AFW-F705P70 TWT
• Manufacturer: Micron Technology Inc

Specifications of MT28C64432W18AFW-F705P70 TWT

• Operating Supply Voltage (max): 1.95V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

NOTE:
Data Sheet Designation
Production:This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject to change, as further
product development and data characterization sometimes occur. Production designation applies to MT28C64432W18/
W30A and MT28C644W18/W30A only.
Advance: This data sheet contains initial descriptions of products still under development. Advance designation applies to
MT28C64416W18/W30A only.
timing, please refer to the table below.
Table 8:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron Technology, Inc.,
inside the U.S. and a trademark of Infineon Technologies outside the U.S. All other trademarks are the property of their respective owners.
09005aef80bcd58d
MT28C64432W18A.fm - Rev. F Pub 2/04 EN
1. All dimensions in millimeters.
DEVICE
Flash
CellularRAM
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
For additional documentation concerning Flash and CellularRAM features, functional descriptions, programming, and
DIMENSIONS APPLY TO
SOLDER BALLS POST REFLOW.
THE PRE-REFLOW BALL
DIAMETER IS Ø 0.35mm ON A
0.30mm SMD BALL PAD.
SEATING PLANE
77X ∅0.35
7.20
References
BALL A8
0.10 C
3.60
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
MT45W4MW16PFA, and MT45W4ML16PFA
MT45W1MW16PAFA, MT45W2MW16PFA,
MT45W1ML16PAFA, MT45W2ML16PFA,
C
2.80
8.00 ±0.10
MT28F644W18/W30
64Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
5.60
0.80
TYP
C L
PART NUMBER
4.00 ±0.05
16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM
Figure 4: 77-Ball FBGA
C L
5.00 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
0.825 ±0.050
10.00 ±0.10
12
®
Micron Technology, Inc., reserves the right to change products or specifications without notice..
1.20 MAX
www.micron.com/cellularram
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
OR 96.5% Sn, 3% Ag, 0.5% Cu
www.micron.com/flash
©2003 Micron Technology, Inc All rights reserved.
LINK
BALL A1 ID