RD28F1604C3TD70S B93 Intel, RD28F1604C3TD70S B93 Datasheet - Page 8

• Manufacturer Part Number: RD28F1604C3TD70S B93
• Manufacturer: Intel

Specifications of RD28F1604C3TD70S B93

• Operating Supply Voltage (max): 3.3V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

C3 SCSP Flash Memory
1.3
72-
Figure 1.
26 Aug 2005
8
Package Ballout
66-Ball SCSP Package Ballout
Notes:
1.
2.
Intel
Flash memory upgrade balls are shown up to A21 (64-Mbit flash) and A22 (128-Mbit flash). In all flash
memory and SRAM combinations, 66 balls are populated on lower density devices. (Upper address
balls are not populated). Ball location A10 is NC on 16/2 devices only.
To maintain compatibility with all JEDEC Variation B options for the C6 ball location, connect this C6
land pad directly to the land pad for the G4 (A17) ball.
®
Advanced+ Boot Block Flash Memory (C3) SCSP Family
A
B
C
D
E
F
G
H
NC
NC
1
Order Number: 252636, Revision: 004
2
F-WE# NC
S-LB# S-UB# S-OE#
S-V
F-WP#
A
A
A
NC
3
20
16
18
SS
F-RP# A
F-V
A
A
A
A
4
11
17
8
5
PP
Top View, Balls Down
A
A
A
A
A
A
5
15
10
21
22
19
7
4
DQ
A
A
A
A
6
14
9
6
0
11
F-CE# F-V
DQ
DQ
DQ
DQ
A
7
A
13
3
15
13
12
9
S-CS
S-WE#
DQ
DQ
DQ
A
A
12
8
2
10
6
8
SS
2
F-V
S-V
DQ
DQ
DQ
F-OE# NC
DQ
A
9
SS
1
CC
4
2
0
14
S-CS
F-V
F-V
DQ
DQ
DQ
DQ
10
CC
CCQ
7
5
3
1
1
#
11
NC
NC
12
Datasheet