RD28F1604C3TD70S B93 Intel, RD28F1604C3TD70S B93 Datasheet - Page 68

• Manufacturer Part Number: RD28F1604C3TD70S B93
• Manufacturer: Intel

Specifications of RD28F1604C3TD70S B93

• Operating Supply Voltage (max): 3.3V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

C3 SCSP Flash Memory
Appendix F Mechanical and Shipping Media Details
F.8
Table 35.
26 Aug 2005
68
Package Height
Ball Height
Package Body Thickness
Ball Lead Diameter
Package Body Length – 16-Mbit/2-Mbit
Package Body Length –
32-Mbit/4-Mbit, 16-Mbit/4-Mbit
Package Body Length –
32-Mbit/8-Mbit
Package Body Width –
16-Mbit/2-Mbit, 16-Mbit/4-Mbit,
32-Mbit/4-Mbit, 32-Mbit/8-Mbit
Mechanical Specification
Note:
Packaging Specifications (0.18µm and 0.25µm) (Sheet 1 of 2)
E
Intel
Shaded pins indicate upper address balls for 64-Mbit and 128-Mbit devices. In all Flash and SRAM
combinations, 66 balls are populated on lower density devices. (Upper address balls are not populated).
A
B
C
D
E
F
G
H
®
1
Advanced+ Boot Block Flash Memory (C3) SCSP Family
Index
A1
2
3
A1
Order Number: 252636, Revision: 004
4
A2
5
Top View - Ball Down
6
D
7
8
Sym
A1
A2
9
D
A
b
E
10
11
13.900
11.900
0.250
0.350
9.900
7.900
12
Min
Millimeters
12.000
14.000
12
0.400
10.00
8.000
0.960
Nom
11
10
10.100
12.100
14.100
9
1. 400
0.450
8.100
Max
Bottom View - Ball Up
8
e
7
A
6
0.0098
0.0138
0.3898
0.4685
0.5472
0.3110
Min
5
4
Y
3
Inches
0.0157
0.3937
0.4724
0.5512
0.3150
0.0378
Nom
2
1
Datasheet
S2
A
B
C
D
E
F
G
H
0.0551
0.0177
0.3976
0.4764
0.5551
0.3189
Max
b
S1