PF38F1030W0ZBQ0S B93 Intel, PF38F1030W0ZBQ0S B93 Datasheet - Page 9

• Manufacturer Part Number: PF38F1030W0ZBQ0S B93
• Manufacturer: Intel

Specifications of PF38F1030W0ZBQ0S B93

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

2.2
Table 1.
Datasheet
Flash Memory Map and Partitioning
Consult the latest Intel
Intel
memory map and partitioning information.
Table 1
configurations. Flash Die #1 (with F1-CE# as its Chip Select) is configured as a bottom boot while
Flash Die #2 (with F2-CE# as its Chip Select) is configured as top boot.
64-Mbit Flash + 32-Mbit Flash Die W18/W30 SCSP Memory Map and Partitioning
Flash Die #2
Flash Die #1
(32-Mbit)
(64-Mbit)
®
Wireless Flash Memory (W30) Datasheet (order number 290702), for individual flash die
and
Table 2
Intel® Wireless Flash Memory (W18/W30 SCSP)
Partitioning
Parameter
Parameter
Partitions
Partitions
Partition
Partition
Main
Main
Order Number: 251407, Revision: 009
show memory map and partitioning information for dual-flash memory die
®
Wireless Flash Memory (W18) Datasheet (order number 290701) and the
Partition 0
Partition 1
Partition 2
Partition 3
Partitions 4-7
Partitions 8-15
Partitions 4-7
Partition 3
Partition 2
Partition 1
Partition 0
Intel® Wireless Flash Memory (W18/W30 SCSP)
Block Size
(KW)
32
32
32
32
32
32
32
32
32
32
32
4
4
Block #
71-134
63-70
56-62
48-55
40-47
32-39
39-70
31-38
23-30
15-22
0-31
8-14
0-7
1C0000-1F7FFF
0C0000-0FFFFF
Address Range
1F8000-1FFFFF
180000-1BFFFF
000000-0FFFFF
200000-3FFFFF
100000-1FFFFF
080000-0BFFFF
140000-17FFFF
100000-13FFFF
040000-07FFFF
008000-03FFFF
000000-007FFF
June 2005
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