PF38F1030W0ZBQ0S B93 Intel, PF38F1030W0ZBQ0S B93 Datasheet - Page 11

• Manufacturer Part Number: PF38F1030W0ZBQ0S B93
• Manufacturer: Intel

Specifications of PF38F1030W0ZBQ0S B93

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

3.0
Figure 1.
Datasheet
Dimensions
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along E
Corner to Ball A1 Distance Along D
Package Information
The following packages are offered with the 32WQ and 64WQ Family :
•
•
Mechanical Specifications for 1- or 2-Die SCSP Device (8x10x1.2 mm)
Figure 1, “Mechanical Specifications for 1- or 2-Die SCSP Device (8x10x1.2 mm)”
Figure 2, “Mechanical Specifications for Triple-Die SCSP Device (8x10x1.4 mm)”
Mark
B
G
M
A
C
D
E
F
H
J
K
L
A2
1
Intel® Wireless Flash Memory (W18/W30 SCSP)
2
3
Top View - Ball
Order Number: 251407, Revision: 009
4
Down
E
5
6
7
8
Symbol
A1
A2
S1
S2
A
D
N
b
E
Y
e
A1
D
Intel® Wireless Flash Memory (W18/W30 SCSP)
0.200
0.325
9.900
7.900
1.100
0.500
Min
A
B
C
D
E
G
H
K
M
F
J
L
Millimeters
8
10.000
0.860
0.375
8.000
0.800
1.200
0.600
Nom
88
b
Bottom View - Ball Up
7
6
10.100
5
1.200
0.425
8.100
0.100
1.300
0.700
Max
4
A
Drawing not to scale.
3
Notes
2
1
0.0079
0.0128
0.3898
0.3110
0.0433
0.0197
Min
e
S2
Y
Inches
0.0339
0.0148
0.3937
0.3150
0.0315
0.0472
0.0236
Nom
88
June 2005
0.04
0.01
0.39
0.31
0.00
0.05
0.02
Ma
11