IP4064CX8/LF/P,135 NXP Semiconductors, IP4064CX8/LF/P,135 Datasheet - Page 2

• Manufacturer Part Number: IP4064CX8/LF/P,135
• Description: IC FILTER/ESD PROT 3CH WLCSP8
• Manufacturer: NXP Semiconductors

Specifications of IP4064CX8/LF/P,135

• Termination Style: Surface Mount (SMD,SMT)
• Filter Type: Signal Line
• Voltage - Rated: 5.5V
• Mounting Type: Surface Mount
• Channels: 3 Channels
• Breakdown Voltage: 10 V
• Capacitance: 20 pF
• Package / Case: WLCSP-8
• Power Dissipation Pd: 180 mW
• Operating Temperature Range: - 30 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Inductance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-5066-2; 934061971135

NXP Semiconductors
2. Pinning information
3. Ordering information
Table 2.
IP4064CX8_IP4364CX8_IP4366CX8_2
Product data sheet
Type number
IP4064CX8/LF/P
IP4364CX8/LF/P
IP4366CX8/P
Ordering information
2.1 Pinning
2.2 Pin description
Table 1.
Pin
A1
A2
A3
B1
B2
B3
C1
C2
C3
Package
Name
WLCSP8
WLCSP8
WLCSP8
Fig 1.
Pin configuration
Pinning
Description
not connected (missing ball)
external pin 1
internal pin 1
external pin 2
ground
internal pin 2
external pin 3
supply ESD protection
internal pin 3
Description
wafer level chip-size package; 8 bumps; 1.41 × 1.41 × 0.65 mm
wafer level chip-size package; 8 bumps; 1.16 × 1.16 × 0.61 mm
wafer level chip-size package; 8 bumps; 1.16 × 1.16 × 0.61 mm
IP4064CX8; IP4364CX8; IP4366CX8
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 11 February 2010
Integrated SIM card passive filter array with ESD protection
bump A1
index area
C
A
B
solder balls facing down
transparent top view,
1
2
008aaa206
3
© NXP B.V. 2010. All rights reserved.
Version
IP4064CX8/LF/P
IP4364CX8/LF/P
IP4366CX8/P
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