IP4064CX8/LF/P,135 NXP Semiconductors, IP4064CX8/LF/P,135 Datasheet - Page 11

• Manufacturer Part Number: IP4064CX8/LF/P,135
• Description: IC FILTER/ESD PROT 3CH WLCSP8
• Manufacturer: NXP Semiconductors

Specifications of IP4064CX8/LF/P,135

• Termination Style: Surface Mount (SMD,SMT)
• Filter Type: Signal Line
• Voltage - Rated: 5.5V
• Mounting Type: Surface Mount
• Channels: 3 Channels
• Breakdown Voltage: 10 V
• Capacitance: 20 pF
• Package / Case: WLCSP-8
• Power Dissipation Pd: 180 mW
• Operating Temperature Range: - 30 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Inductance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-5066-2; 934061971135

NXP Semiconductors
10. Abbreviations
Table 7.
11. Revision history
Table 8.
IP4064CX8_IP4364CX8_IP4366CX8_2
Product data sheet
Acronym
DUT
EMI
ESD
NWA
PCB
PCS
RFI
RoHS
SIM
WLCSP
Document ID
IP4064CX8_IP4364CX8_
IP4366CX8_2
Modifications:
IP4064CX8LF_IP4364CX8LF_1 20071112
Abbreviations
Revision history
9.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
Cleaning can be done after reflow soldering.
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
NetWork Analyzer
Printed-Circuit Board
Personal Communication System
Radio Frequency Interference
Restriction of Hazardous Substances
Subscriber Identity Module
Wafer-Level Chip-Scale Package
Release date
20100211
•
•
•
Type number IP4366CX8 added
Figure
General editorial update
IP4064CX8; IP4364CX8; IP4366CX8
All information provided in this document is subject to legal disclaimers.
3: added
Rev. 02 — 11 February 2010
Data sheet status Change notice Supersedes
Product data sheet -
Product data sheet -
Integrated SIM card passive filter array with ESD protection
IP4064CX8LF_IP4364CX8LF_1
-
© NXP B.V. 2010. All rights reserved.
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