IP4064CX8/LF/P,135 NXP Semiconductors, IP4064CX8/LF/P,135 Datasheet
IP4064CX8/LF/P,135
Specifications of IP4064CX8/LF/P,135
934061971135
Related parts for IP4064CX8/LF/P,135
IP4064CX8/LF/P,135 Summary of contents
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IP4064CX8; IP4364CX8; IP4366CX8 Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 Rev. 02 — 11 February 2010 1. Product profile 1.1 General description The IP4064CX8, IP4364CX8 and IP4366CX8 are 3-channel RC low-pass filter arrays ...
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... NXP Semiconductors 2. Pinning information 2.1 Pinning Fig 1. 2.2 Pin description Table 1. Pin Ordering information Table 2. Ordering information Type number Package Name IP4064CX8/LF/P WLCSP8 IP4364CX8/LF/P WLCSP8 IP4366CX8/P WLCSP8 IP4064CX8_IP4364CX8_IP4366CX8_2 Product data sheet IP4064CX8; IP4364CX8; IP4366CX8 Integrated SIM card passive filter array with ESD protection ...
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... NXP Semiconductors 4. Functional diagram Fig 2. 5. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ESD tot T stg T reflow(peak) T amb Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC61000-4-2 [1] model and far exceeds the specified level contact discharge). ...
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... NXP Semiconductors 6. Characteristics Table amb Symbol Parameter R s(ch [1] Guaranteed by design. 7. Application information 7.1 Application diagram A typical application diagram showing IP4064CX8, IP4364CX8 or IP4366CX8 in a SIM card interface is depicted in connected to the baseband interface side while the four 15 kV ESD compliant pins (A2, B1, C1 and C2) are connected to the SIM card. ...
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... NXP Semiconductors 7.2 Insertion loss The IP4064CX8, IP4364CX8 and IP4366CX8 are mainly designed as an EMI/RFI filter for SIM card interfaces. The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for evaluation of the IP4064CX8, IP4364CX8 and IP4366CX8 is shown in The insertion loss Ω NWA system for all three channels of IP4064CX8 and ...
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... NXP Semiconductors 7.3 Crosstalk The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of the IP4064CX8, IP4364CX8 and IP4366CX8 is shown in Four typical examples of crosstalk measurement results of IP4064CX8 and IP4364CX8 are depicted in Unused channels are terminated with 50 Ω to ground. Fig 6. Crosstalk measurement configuration ...
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... NXP Semiconductors 8. Package outline WLCSP8: wafer level chip-size package; 8 bumps ( A1) bump A1 index area European projection Fig 8. Package outline (WLCSP8) IP4064CX8_IP4364CX8_IP4366CX8_2 Product data sheet IP4064CX8; IP4364CX8; IP4366CX8 Integrated SIM card passive filter array with ESD protection All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors Table 5. Symbol IP4064CX8 IP4364CX8 and IP4366CX8 IP4064CX8_IP4364CX8_IP4366CX8_2 Product data sheet IP4064CX8; IP4364CX8; IP4366CX8 Integrated SIM card passive filter array with ESD protection Dimensions for Figure 8 Min 0.60 0.22 0.38 0.27 1.36 1. 0.56 0.18 0.38 0.21 1.11 1. All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 9. Soldering of WLCSP packages 9.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount reflow soldering description” ...
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... NXP Semiconductors Fig 9. For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 9.3.1 Stand off The stand off between the substrate and the chip is determined by: • The amount of printed solder on the substrate • The size of the solder land on the substrate • ...
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... NXP Semiconductors Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information 7.1 Application diagram . . . . . . . . . . . . . . . . . . . . . 4 7.2 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 ...