PCA8565BS/1-T NXP Semiconductors, PCA8565BS/1-T Datasheet - Page 35
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PCA8565BS/1-T
Manufacturer Part Number
PCA8565BS/1-T
Description
Real Time Clock AUTOMOTIVE CLOCK/CAL
Manufacturer
NXP Semiconductors
Datasheet
1.PCA8565BS1-T.pdf
(39 pages)
Specifications of PCA8565BS/1-T
Bus Type
Serial (2-Wire, I2C)
Operating Supply Voltage (typ)
2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
1.8V
Operating Temperature (min)
-40C
Pin Count
10
Mounting
Surface Mount
Date Format
DW:DM:M:Y
Time Format
HH:MM:SS
Mounting Style
SMD/SMT
Package / Case
HVSON
Lead Free Status / RoHS Status
Compliant
Other names
PCA8565BS/1,118
NXP Semiconductors
PCA8565_2
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 32.
Table 33.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 32
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
33
30.
Rev. 02 — 16 June 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
30) than a SnPb process, thus
220
220
350
Real time clock/calendar
> 2000
260
245
245
PCA8565
© NXP B.V. 2009. All rights reserved.
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