UJA1069TW24/5V0/C: NXP Semiconductors, UJA1069TW24/5V0/C: Datasheet - Page 58

• Manufacturer Part Number: UJA1069TW24/5V0/C:
• Description: UJA1069TW24/HTSSOP24/REEL13DP/
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/5V0/C:

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935285413518

NXP Semiconductors
12. Package outline
Fig 27. Package outline SOT549-1 (HTSSOP32)
UJA1069_4
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 04 — 28 October 2009
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
LIN fail-safe system basis chip
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
L
0.1
p
w
UJA1069
© NXP B.V. 2009. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
58 of 64
o
A