PIC16F1847-I/SO Microchip Technology, PIC16F1847-I/SO Datasheet - Page 358

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PIC16F1847-I/SO

Manufacturer Part Number
PIC16F1847-I/SO
Description
14 KB Flash, 1K Bytes RAM, 32 MHz Int. Osc, 16 I/0, Enhanced Mid Range Core 18 S
Manufacturer
Microchip Technology
Datasheets

Specifications of PIC16F1847-I/SO

Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F1847-I/SO
Manufacturer:
MICROCHIP
Quantity:
30 000
Part Number:
PIC16F1847-I/SO
0
PIC16(L)F1847
30.6
DS41453A-page 360
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
= Junction Temperature.
JMAX
= Ambient Temperature.
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
Typ.
65.5
76.0
89.3
31.1
TBD
29.5
23.5
31.1
TBD
150
5.0
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
18-pin PDIP package
18-pin SOIC package
20-pin SSOP package
28-pin QFN package (6x6)
28-pin UQFN package (4x4)
18-pin PDIP package
18-pin SOIC package
20-pin SSOP package
28-pin QFN package (6x6)
28-pin UQFN package (4x4)
PD = P
P
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
 2011 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))

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