LAN83C185-JT Standard Microsystems (SMSC), LAN83C185-JT Datasheet - Page 60

• Manufacturer Part Number: LAN83C185-JT
• Manufacturer: Standard Microsystems (SMSC)

Specifications of LAN83C185-JT

• Lead Free Status / RoHS Status: Compliant

Chapter 7 Package Outline
Revision 0.8 (06-12-08)
ccc
A1
A2
E1
R2
L1
D1
W
A
D
E
H
R
L
e
θ
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
11.80
11.80
0.05
1.35
9.80
9.80
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm per side.
Figure 7.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 2 MM Footprint
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
Table 7.1 64 Pin TQFP Package Parameters
High Performance Single Chip Low Power 10/100 Ethernet Physical Layer Transceiver (PHY)
12.20
10.20
12.20
10.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
60
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Length
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
SMSC LAN83C185
Datasheet