TXC-03401BITQ Transwitch Corporation, TXC-03401BITQ Datasheet - Page 32

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TXC-03401BITQ

Manufacturer Part Number
TXC-03401BITQ
Description
Manufacturer
Transwitch Corporation
Datasheet

Specifications of TXC-03401BITQ

Number Of Transceivers
1
Operating Supply Voltage (typ)
5V
Screening Level
Industrial
Mounting
Surface Mount
Package Type
TQFP
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
5.25V
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Lead Free Status / RoHS Status
Not Compliant
OPERATION
POWER, GROUND AND EXTERNAL COMPONENTS
Figure 18 shows the recommended power and ground connection method for the DS3F device. Separate
planes should be employed for VDD and GND. Bypass networks consist of a 10 F capacitor in parallel with
0.1 F capacitors for each VDD pin, as shown. These 0.1 F capacitors should be RF-quality and closely con-
nected to each of the device’s VDD pins to decouple them to ground.
THROUGHPUT DELAYS
The DS3F throughput delays for the serial terminal interface are given below in terms of DS3 bit times
(1 bit = 22.35 nsec nominal):
1. The throughput delay from the transmit terminal side input to the transmit line side output is 3 bit
2. The throughput delay from the receive line side input to the receive terminal side output is 2 bit times.
times.
Proprietary TranSwitch Corporation Information for use Solely by its Customers
44/48
33/32
67/75
22/21
53/57
6/8
Figure 18. Power Supply Connections
GND
GND
GND
GND
GND
GND
TXC-03401B
DS3F
- 32 of 54 -
VDD
VDD
VDD
VDD
VDD
VDD
DATA SHEET
4/1
17/14
27/30
38/44
51/54
63/70
10 F
NOTE:
All capacitors are 0.1
microfarads unless
otherwise specified.
+
+5V
TXC-03401B
TXC-03401B-MB
Ed. 6, June 2001
DS3F

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