SP400-0.007-00-104 Bergquist, SP400-0.007-00-104 Datasheet - Page 17

• Manufacturer Part Number: SP400-0.007-00-104
• Description: THERMAL PAD TO-220 .007" SP400
• Manufacturer: Bergquist
• Series: Sil-Pad® 400r

Specifications of SP400-0.007-00-104

• Usage: TO-218, TO-220, TO-247
• Shape: Rectangular
• Outline: 25.40mm x 19.05mm
• Thickness: 0.007" (0.178mm)
• Backing, Carrier: Fiberglass
• Color: Gray
• Thermal Resistivity: 1.13°C/W
• Thermal Conductivity: 0.9 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 3223-07FR-104; BER204; BG426704

Ultra Thin Circuits utilizing Bond-Ply
Heat Spreading Capability
Dielectric thickness and foil thickness both influence heat spreading
capability in Thermal Clad. Heat spreading is one of the most powerful
advantages derived from IMS. By increasing copper conductor thick-
ness, heat spreading increases and brings junction temperature down.
In some cases very heavy copper can be utilized along with bare die
to eliminate the need for a standard packaged component.
The following graphs depict both the thermal impedance value and
case temperature when relating dielectric and foil thickness.
40 Watt TO-220 soldered to 1" by 1" (25mm x 25mm)
.002"
(51)
1 oz (35µm) circuit foil
3 oz (105µm) circuit foil
6 oz (210µm) circuit foil
10 oz (350µm) circuit foil
Bergquist RD2018 T est Method
.003"
(76)
Thermal Clad MP
Dielectric Thickness Inches (µm)
(102)
.004"
®
450 PA. See pages 11 and 18 for additional information.
.005"
(127)
.006"
(152)
.007"
(178)
NOTE: Copper foil is NOT measured for thickness as a control method. Instead,
CAUTION! Values in IPC-4562 (Table 1.1) are not representative
Standard Circuit Layer Thickness
(Zinc Treatment)
MATERIAL
40 Watt TO-220 soldered to 1" by 1" (25mm x 25mm)
Copper
.002"
(51)
it is certified to an area weight requirement per IPC-4562. The nominal
thickness given on 1 oz. copper is 0.0014"/35 µm.
of mechanical thickness.
1 oz (35µm) circuit foil
3 oz (105µm) circuit foil
6 oz (210µm) circuit foil
10 oz (350µm) circuit foil
Bergquist RD2018 T est Method
.003"
(76)
WEIGHT
Dielectric Thickness Inches (µm )
(oz/ft
Thermal Clad MP
10
1
2
3
4
5
6
8
2
)
.004"
(102)
REFERENCE THICKNESS
0.0014
0.0028
0.0042
0.0056
0.0070
0.0084
0.0112
0.0140
inches
.005"
(127)
(152)
.006"
105
140
175
210
280
350
µm
35
70
.007"
(178)
15