SP400-0.007-00-104 Bergquist, SP400-0.007-00-104 Datasheet - Page 11

• Manufacturer Part Number: SP400-0.007-00-104
• Description: THERMAL PAD TO-220 .007" SP400
• Manufacturer: Bergquist
• Series: Sil-Pad® 400r

Specifications of SP400-0.007-00-104

• Usage: TO-218, TO-220, TO-247
• Shape: Rectangular
• Outline: 25.40mm x 19.05mm
• Thickness: 0.007" (0.178mm)
• Backing, Carrier: Fiberglass
• Color: Gray
• Thermal Resistivity: 1.13°C/W
• Thermal Conductivity: 0.9 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 3223-07FR-104; BER204; BG426704

Applications
Operating Temperatures
Choose the dielectric that best suits your operating temperature
environment. For high temperature applications, such as automotive,
HT offers the right solution. All of our dielectrics are U.L. recognized
(HPL pending).
*Covers all soldering options including Eutectic Gold / Tin.
HPL-03015
Part
Number
HT-04503
HT-07006
MP-06503
CML-11006
HT-09009
HT-07006
Method
Description
Note: For applications with an expected voltage over 480 Volts AC, Bergquist recommends a dielectric thickness greater than 0.003" (76µm).
Note: Maximum test voltage is a function of material and circuit design.Typical proof test does not represent the maximum.
Note: Circuit design is the most important consideration for determining safety agency compliance.
HT
MP
CML
HT*
MP
CML
MATERIAL
MATERIAL
HIGH POWER LIGHTING
SINGLE LAYER
MULTI-LAYER
*
Summary Of Key Dielectric Characteristics
1 - Optical
2- Internal TO-220 test
[.000"/µm]
Thickness
1.5/38
9/229
6/152
6/152
6/152
3/76
3/76
RD 2018
U.L. RTI - ELECTRO / MECHANICAL
1
U.L. SOLDER LIMIT RATING
325°C / 60 seconds
300°C / 60 seconds
260°C / 60 seconds
Impedance
140°C / 140°C
130°C / 140°C
130°C / 130°C
[°C/W]
0.90
0.70
1.10
0.30
0.45
0.70
0.65
THERMAL PERFORMANCE
3 - Calculation from ASTM 5470
4 - Extended ASTM 5470
5 - ASTM D149
2
[°C in
[°C cm
0.16 / 1.03
0.21 / 1.35
0.02 / 0.13
0.05 / 0.32
0.09 / 0.58
0.11/ 0.71
Impedance
0.11/ 0.71
2
/W] /
2
/W]
3
Conductivity
[W/m-K]
2.2
2.2
1.1
3.0
2.2
2.2
1.3
Temperature of
25°C Water In
(T
Thermal Impedance
This drawing represents RD 2018 (at 40W) TO-220 thermal
performance (25°C Cold Plate Testing).
IMS Base
4
B
6 - ASTM D150
7 - Internal MDSC test RD 2014
8 - U.L. 746 E
ºC)
Breakdown
DIELECTRIC PERFORMANCE
[kVAC]
Temperature of
Transistor Base
20.0
11.0
10.0
11.0
2.5
6.0
8.5
(T
T
ºC)
5
Water-cooled Heatsink
θ
Permittivity
[Dielectric
Constant]
( )
60 lb Force
ºC
W
TO-220
7
7
7
6
7
7
6
=
6
9 - ASTM D2861
*
**Pending
Transition
(T
CML is available in prepreg form
Glass
150
150
185
[°C]
40W
150
150
90
90
T
- T
7
B
150/150
140/140
130/130
140/140
140/140
130/140
)
Index
[°C]
U.L.
**
OTHER
Circuit Layer (IMS)
Dielectric (IMS)
Greased Interface
8
Water Out
[lb/in] / [N/mm]
Metal Base Plate (IMS)
Greased Interface
Strength
10 / 1.8
5 / 0.9
9 / 1.6
6 / 1.1
6 / 1.1
6 / 1.1
6 / 1.1
Peel
9
9