SP400-0.007-00-104 Bergquist, SP400-0.007-00-104 Datasheet - Page 13

• Manufacturer Part Number: SP400-0.007-00-104
• Description: THERMAL PAD TO-220 .007" SP400
• Manufacturer: Bergquist
• Series: Sil-Pad® 400r

Specifications of SP400-0.007-00-104

• Usage: TO-218, TO-220, TO-247
• Shape: Rectangular
• Outline: 25.40mm x 19.05mm
• Thickness: 0.007" (0.178mm)
• Backing, Carrier: Fiberglass
• Color: Gray
• Thermal Resistivity: 1.13°C/W
• Thermal Conductivity: 0.9 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: 3223-07FR-104; BER204; BG426704

Ultra Thin Circuits
Ultra Thin Circuits (UTC) utilize T-Clad
thick base layer. These circuits are often used for component level
packaging where the thick aluminum or copper base is not required
for mechanical or thermal mass. The circuit layer is a “stand-alone”
ceramic submount replacement where the heat spreading and heat
sinking is done in a different location. In addition, UTC can often be
used for standard component package mounting. In some cases, the
thermal performance and heat dissipation of the UTC is adequate to
eliminate the need for heat sinking altogether. The total profile of a
UTC can be as thin as 0.009" (0.23mm) and can be built up into mul-
tilayer structures.This type of structure is also available with Bond-Ply
450 thermally conductive PSA tape pre-applied to the back. See page
15 for examples of this format.
Active Baseplates
Electrical Vias To Baseplate
A copper IMS baseplate can be used as an active circuit with the
use of blind plated electrical via’s that connects the top circuit
layer to the base metal.
Selective Dielectric Removal
Bergquist has developed a process for selectively removing dielec-
tric to expose the baseplate. This surface can be surface finished
like the other circuit pads. We are not limited to geometry or size
of the dielectric removal area. Selective removal features can be
placed very accurately with respect to the circuits.
Pedestal
Using a copper base and by selectively removing the dielectric
a pedestal can be formed moving the base metal up to be
co-planar with adjacent circuits.
Pedestal formation through selective dielectric removal.
Bergquist Dielectric
Baseplate
Pedestal
®
dielectrics without the typical
Copper Foil
(Circuit)
...In Specialty Applications
For more detail regarding design and tolerance recommendations
for active baseplates, please contact your Bergquist representative
for a White Paper.
Electrical vias to baseplate.
Photographic example of UTC versus a standard 0.062" (1.57mm) aluminum substrate.
Selective dielectric removal.
Bergquist Dielectric
Dielectric Removal Area
Dielectric Edge
Copper-Plated
Blind Via
Bergquist Dielectric
Copper Foil
(Circuit)
Baseplate
Baseplate
Copper Foil
(Circuit)
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