PBLS2002S,115 NXP Semiconductors, PBLS2002S,115 Datasheet
PBLS2002S,115
Specifications of PBLS2002S,115
PBLS2002S T/R
PBLS2002S T/R
Related parts for PBLS2002S,115
PBLS2002S,115 Summary of contents
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PBLS2002S 20 V PNP BISS loadswitch Rev. 02 — 24 August 2009 1. Product profile 1.1 General description PNP low V Equipped Transistor (RET SOT96-1 (SO8) small Surface-Mounted Device (SMD) plastic package. 1.2 Features I Low V I ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBLS2002S 4. Marking Table 4. Type number PBLS2002S PBLS2002S_2 Product data sheet Pinning Description input (base) TR2 GND (emitter) TR2 base TR1 emitter TR1 collector TR1 collector TR1 output (collector) TR2 output (collector) TR2 ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol TR1; PNP low V V CBO V CEO V EBO tot TR2; NPN resistor-equipped transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors (1) Ceramic PCB, Al (2) FR4 PCB, mounting pad for collector 1cm (3) FR4 PCB, standard footprint Fig 1. 6. Thermal characteristics Table 6. Symbol Per device R th(j-a) TR1; PNP low V R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) (K/W) 1.0 0. 0.5 0.33 0.2 0.1 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 2. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0.5 0.33 ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 2 10 1.0 0.75 0.5 0.33 0.2 10 0.1 0.05 0.02 0. Ceramic PCB standard footprint 2 3 Fig 4. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table unless otherwise specified ...
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... NXP Semiconductors Table unless otherwise specified amb Symbol V BEsat V BEon off TR2; NPN resistor-equipped transistor I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Pulse test: t PBLS2002S_2 Product data sheet Characteristics …continued Parameter Conditions base-emitter saturation voltage base-emitter turn- voltage delay time ...
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... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 5. TR1 (PNP): DC current gain as a function of collector current; typical values 1 (V) 0.9 (1) 0.7 (2) 0.5 (3) 0 amb ( amb ( 100 C amb Fig 7. TR1 (PNP): Base-emitter voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1 V CEsat (V) ( 100 C amb ( amb ( amb Fig 9. TR1 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values 10 R CEsat ( ) ( 100 C amb ( amb ( amb Fig 11. TR1 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values PBLS2002S_2 Product data sheet ...
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... NXP Semiconductors ( 150 C amb ( amb ( amb Fig 13. TR2 (NPN): DC current gain as a function of collector current; typical values 10 V I(on) (V) (1) ( amb ( amb ( 100 C amb Fig 15. TR2 (NPN): On-state input voltage as a function of collector current; typical values PBLS2002S_2 Product data sheet ...
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... NXP Semiconductors 8. Test information Fig 17. BISS transistor switching time definition Fig 18. Test circuit for switching times PBLS2002S_2 Product data sheet (probe) oscilloscope 450 100 mA 100 mA open Bon Boff Rev. 02 — 24 August 2009 PBLS2002S 20 V PNP BISS loadswitch input pulse (idealized waveform) ...
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... NXP Semiconductors 9. Package outline Fig 19. Package outline SOT96-1 (SO8) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBLS2002S [1] For further information and the availability of packing methods, see PBLS2002S_2 Product data sheet 5.0 4 ...
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... NXP Semiconductors 11. Soldering Fig 20. Reflow soldering footprint SOT96-1 (SO8) Fig 21. Wave soldering footprint SOT96-1 (SO8) PBLS2002S_2 Product data sheet 5.50 0. solder lands occupied area placement accuracy 5.50 board direction solder lands solder resist placement accurracy 0.25 occupied area Rev. 02 — ...
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... Revision history Document ID Release date PBLS2002S_2 20090824 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PBLS2002S_1 20060804 PBLS2002S_2 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12 Revision history ...