XC2VP20-6FG676I Xilinx Inc, XC2VP20-6FG676I Datasheet - Page 198

• Manufacturer Part Number: XC2VP20-6FG676I
• Description: FPGA Virtex-II Pro™ Family 20880 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 676-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-II Pror

Specifications of XC2VP20-6FG676I

• Package: 676FBGA
• Family Name: Virtex-II Pro™
• Device Logic Units: 20880
• Number Of Registers: 18560
• Maximum Internal Frequency: 1200 MHz
• Typical Operating Supply Voltage: 1.5 V
• Maximum Number Of User I/os: 404
• Ram Bits: 1622016
• Number Of Logic Elements/cells: 20880
• Number Of Labs/clbs: 2320
• Total Ram Bits: 1622016
• Number Of I /o: 404
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 676-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

R
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
pitch).
www.xilinx.com
DS083 (v4.7) November 5, 2007
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Product Specification
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