MT48LC4M32LFF5-8 IT:G TR Micron Technology Inc, MT48LC4M32LFF5-8 IT:G TR Datasheet - Page 79
![DRAM Chip Mobile SDRAM 128M-Bit 4Mx32 3.3V 90-Pin VFBGA T/R](/photos/7/23/72313/mfg557-90-vfbga_sml.jpg)
MT48LC4M32LFF5-8 IT:G TR
Manufacturer Part Number
MT48LC4M32LFF5-8 IT:G TR
Description
DRAM Chip Mobile SDRAM 128M-Bit 4Mx32 3.3V 90-Pin VFBGA T/R
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet
1.MT48LC8M16LFB4-75MG_TR.pdf
(80 pages)
Specifications of MT48LC4M32LFF5-8 IT:G TR
Density
128 Mb
Maximum Clock Rate
125 MHz
Package
90VFBGA
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
19|8|7 ns
Operating Temperature
-40 to 85 °C
Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (4Mx32)
Speed
125MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
90-VFBGA
Organization
4Mx32
Address Bus
14b
Access Time (max)
19/8/7ns
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Figure 58:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. M 1/09 EN
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball FBGA, “F5/B5” Package (x32 Device), 8mm x 13mm
BALL A9
5.60 ±0.05
Notes:
A
0.65 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.025mm.
3. Package width and length do not include mold protrusion; allowable mold protrusion is
4. Topside part marking decoder can be found at
0.25mm per side.
3.20
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
79
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
128Mb: x16, x32 Mobile SDRAM
www.micron.com/decoder.
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
BALL A1 ID