MT48LC4M32B2P-6 IT:G Micron Technology Inc, MT48LC4M32B2P-6 IT:G Datasheet - Page 47

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MT48LC4M32B2P-6 IT:G

Manufacturer Part Number
MT48LC4M32B2P-6 IT:G
Description
DRAM Chip SDRAM 128M-Bit 4Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2P-6 IT:G

Package
86TSOP-II
Density
128 Mb
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Clock Rate
166 MHz
Maximum Random Access Time
17|7.5|5.5 ns
Operating Temperature
-40 to 85 °C
Table 19:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
PARAMETER
READ/WRITE command to READ/WRITE command
CKE to clock disable or power-down entry mode
CKE to clock enable or power-down exit setup mode
DQM to input data delay
DQM to data mask during WRITEs
DQM to data High-Z during READs
WRITE command to input data delay
Data-in to ACTIVE command
Data-in to PRECHARGE command
Last data-in to burst STOP command
Last data-in to new READ/WRITE command
Last data-in to PRECHARGE command
LOAD MODE REGISTER command to ACTIVE or REFRESH command
Data-out to High-Z from PRECHARGE command
AC Functional Characteristics
Notes 5, 6, 7, 8, 9, 11 apply to the entire table; notes appear on page 48
47
CL = 3
CL = 2
CL = 1
CL = 3
CL = 2
CL = 1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL
t
t
t
t
t
t
ROH (3)
ROH (2)
ROH (1)
DAL (3)
DAL (2)
DAL (1)
t
t
t
t
t
t
t
CKED
t
DQM
DWD
t
t
t
t
MRD
DQD
DQZ
CCD
PED
DPL
BDL
CDL
RDL
-6
Electrical Specifications
1
1
1
0
0
2
0
5
4
3
2
1
1
2
2
3
2
1
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
-7
1
1
1
0
0
2
0
5
4
3
2
1
1
2
2
3
2
1
UNITS
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
NOTES

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