PBSS4160DPN,115 NXP Semiconductors, PBSS4160DPN,115 Datasheet
PBSS4160DPN,115
Specifications of PBSS4160DPN,115
934058119115
PBSS4160DPN T/R
PBSS4160DPN T/R
Related parts for PBSS4160DPN,115
PBSS4160DPN,115 Summary of contents
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PBSS4160DPN NPN/PNP low V Rev. 03 — 11 December 2009 1. Product profile 1.1 General description NPN/PNP low V (SC-74) Surface Mounted Device (SMD) plastic package. 1.2 Features Low collector-emitter saturation voltage V High collector current ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS4160DPN 4. Marking Table 4. Type number PBSS4160DPN 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor unless otherwise specified; for the PNP transistor with negative polarity ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot Per device P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on a ceramic PCB δ th(j-a) 0.75 (K/W) ...
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... NXP Semiconductors δ th(j-a) (K/W) 0.75 0. 0.33 0.20 0.10 0.05 10 0.02 0. −5 − FR4 PCB, mounting pad for collector 1 cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse time; typical values th(j-a) δ (K/W) 0.75 0. 0.33 0.20 0.10 0. ...
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... NXP Semiconductors 7. Characteristics Table 7. ° amb Symbol Per transistor unless otherwise specified; for the PNP transistor with negative polarity I CBO I CES I EBO V BEsat V BEon TR1 (NPN CEsat R CEsat off TR2 (PNP PBSS4160DPN_3 Product data sheet NPN/PNP low V Characteristics C unless otherwise specified. ...
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... NXP Semiconductors Table 7. ° amb Symbol V CEsat R CEsat off [1] Pulse test: t PBSS4160DPN_3 Product data sheet NPN/PNP low V Characteristics …continued C unless otherwise specified. Parameter Conditions = −100 mA; collector-emitter saturation −1 mA voltage −500 mA − − − collector-emitter saturation I C resistance = −0.5 A; delay time −25 mA; ...
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... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 0 − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. TR1 (NPN): DC current gain as a function of collector current; typical values 1 V CEsat (V) −1 10 (1) (2) (3) −2 10 − 100 °C (1) T amb = 25 ° ...
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... NXP Semiconductors 1.2 V BEsat (V) 1.0 (1) 0.8 (2) 0.6 (3) 0.4 0.2 − −55 °C (1) T amb = 25 °C (2) T amb = 100 °C (3) T amb Fig 9. TR1 (NPN): Base-emitter saturation voltage as a function of collector current; typical values 2.0 I (mA (A) 52.0 1.6 39.0 26.0 1.2 13 ...
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... NXP Semiconductors 600 ( 400 (2) (3) 200 0 −1 −10 −1 −10 −10 = − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 13. TR2 (PNP): DC current gain as a function of collector current; typical values −1 V CEsat (V) −1 −10 (1) (2) (3) −2 −10 − ...
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... NXP Semiconductors −1.1 V BEsat (V) −0.9 (1) −0.7 (2) −0.5 (3) −0.3 −0.1 −1 −10 −1 −10 − −55 °C (1) T amb = 25 °C (2) T amb = 100 °C (3) T amb Fig 17. TR2 (PNP): Base-emitter saturation voltage as a function of collector current; typical values −2.0 (mA) = −35 −31.5 C (A) − ...
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... NXP Semiconductors 8. Test information Fig 21. TR1 (NPN): BISS transistor switching time definition I Fig 22. TR1 (NPN): Test circuit for switching times PBSS4160DPN_3 Product data sheet NPN/PNP low (probe) oscilloscope 450 Ω −25 mA open 100 Ω 0 mA Bon Boff Rev. 03 — 11 December 2009 ...
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... NXP Semiconductors − − Fig 23. TR2 (PNP): BISS transistor switching time definition I Fig 24. TR2 (PNP): Test circuit for switching times PBSS4160DPN_3 Product data sheet NPN/PNP low (probe) oscilloscope 450 Ω −0 − open 100 Ω Bon Boff Rev. 03 — 11 December 2009 ...
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... NXP Semiconductors 9. Package outline Fig 25. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBSS4160DPN [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 11. Soldering 3.30 Dimensions in mm Fig 26. Reflow soldering footprint 5.05 Dimensions in mm Fig 27. Wave soldering footprint PBSS4160DPN_3 Product data sheet NPN/PNP low V 3.45 1.95 0.95 2.825 1.60 1.70 3.10 3.20 5.30 1.40 4.30 Rev. 03 — 11 December 2009 PBSS4160DPN (BISS) transistor ...
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... Revision history Table 9. Revision history Document ID Release date PBSS4160DPN_3 20091211 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure PBSS4160DPN_2 20050714 PBSS4160DPN_1 20040603 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 10 Packing information . . . . . . . . . . . . . . . . . . . . 14 11 Soldering ...