SHF-0189 Sirenza Microdevices Inc, SHF-0189 Datasheet - Page 5

• Manufacturer Part Number: SHF-0189
• Description: IC HFET ALGAAS/GAAS .5W SOT-89
• Manufacturer: Sirenza Microdevices Inc

Specifications of SHF-0189

• Transistor Type: HFET
• Frequency: 1.96GHz
• Gain: 20.1dB
• Voltage - Rated: 9V
• Current Rating: 200mA
• Noise Figure: 3.2dB
• Current - Test: 100mA
• Voltage - Test: 8V
• Power - Output: 27.5dBm
• Package / Case: SOT-89
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 599-1060-2

Mounting and Thermal Considerations
It is very important that adequate heat sinking be provided to minimize the device junction temperature. The following items
should be implemented to maximize MTTF and RF performance.
1. Multiple solder-filled vias are required directly below the ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with multiple plated-through vias around pin 4 of the device. [CRITICAL]
3. Use two point board seating to lower the thermal resistance between the PCB and mounting plate. Place machine screws as
close to the ground tab (pin 4) as possible. [RECOMMENDED]
4. Use 2 ounce copper to improve the PCB’s heat spreading capability. [RECOMMENDED]
EDS-101240 Rev G
Pin
1
2
3
4
Recommended Mounting Configuration for Optimum RF and Thermal
Function
Source
Source
Drain
Gate
Description
RF input.
Connection to ground. Use via holes to reduce lead inductance. Place via holes as close to ground leads as possible.
RF output.
Same as pin 2.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
(0.020" DIA)
Plated Thru
Machine
Screws
Holes
Performance
Ground Plane
SHF-0x89
SHF-0189(Z)
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