STW52NK25Z STMicroelectronics, STW52NK25Z Datasheet - Page 3

• Manufacturer Part Number: STW52NK25Z
• Description: MOSFET N-CH 250V 52A TO-247
• Manufacturer: STMicroelectronics
• Series: SuperMESH™r

Specifications of STW52NK25Z

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 45 mOhm @ 26A, 10V
• Drain To Source Voltage (vdss): 250V
• Current - Continuous Drain (id) @ 25° C: 52A
• Vgs(th) (max) @ Id: 4.5V @ 150µA
• Gate Charge (qg) @ Vgs: 160nC @ 10V
• Input Capacitance (ciss) @ Vds: 4850pF @ 25V
• Power - Max: 300W
• Mounting Type: Through Hole
• Package / Case: TO-247-3
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.045 Ohm @ 10 V
• Forward Transconductance Gfs (max / Min): 25 S
• Drain-source Breakdown Voltage: 250 V
• Gate-source Breakdown Voltage: +/- 30 V
• Continuous Drain Current: 52 A
• Power Dissipation: 300000 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 55 C
• Continuous Drain Current Id: 26A
• Drain Source Voltage Vds: 250V
• On Resistance Rds(on): 33mohm
• Rds(on) Test Voltage Vgs: 10V
• Threshold Voltage Vgs Typ: 3.75V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4428-5

ELECTRICAL CHARACTERISTICS (T
Table 7: On/Off
Table 8: Dynamic
Table 9: Source Drain Diode
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
C
V
Symbol
Symbol
Symbol
I
R
oss eq.
V
V
SDM
(BR)DSS
g
t
t
I
I
I
C
SD
I
DS(on)
C
GS(th)
C
Q
d(on)
d(off)
Q
fs
RRM
RRM
DSS
GSS
I
2. Pulse width limited by safe operating area.
3. C
Q
Q
Q
SD
t
t
oss
t
t
iss
rss
rr
rr
gs
gd
r
f
(1)
g
rr
rr
(1)
V
(2)
DSS
oss eq.
(3)
.
is defined as a constant equivalent capacitance giving the same charging time as C
Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (V
Gate-body Leakage
Current (V
Gate Threshold Voltage
Static Drain-source On
Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Equivalent Output
Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Source-drain Current
Source-drain Current (pulsed)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Parameter
Parameter
Parameter
DS
= 0)
GS
= 0)
CASE
I
V
V
V
V
V
V
V
V
R
(see Figure 17)
V
V
I
I
V
(see Figure 18)
I
V
(see Figure 18)
D
V
SD
SD
SD
DS
DS
GS
DS
GS
DS
GS
DD
DD
GS
DD
DD
G
DS
= 1 mA, V
=25°C UNLESS OTHERWISE SPECIFIED)
= 4.7
= 52 A, V
= 52 A, di/dt = 100A/µs
= 52 A, di/dt = 100A/µs
= Max Rating
= Max Rating, T
= ± 20V
= V
= 10V, I
= 15 V
= 0V, V
= 125V, I
= 200 V, I
= 10V
= 100 V, T
= 100 V, T
= 25V, f = 1 MHz, V
Test Conditions
Test Conditions
Test Conditions
GS
, I
,
V
DS
I
D
GS
D
GS
D
GS
D
= 26 A
D
= 150 µA
= 26 A
j
j
= 0V to 200 V
= 26 A
= 0
= 10 V
= 25°C
= 150°C
= 52 A,
= 0
C
= 125 °C
GS
= 0
Min.
Min.
Min.
250
3
oss
when V
0.033
0.285
4850
Typ.
3.75
Typ.
Typ.
0.37
855
222
720
160
285
336
115
2.2
25
40
75
55
32
87
2
DS
increases from 0 to 80%
STW52NK25Z
0.045
Max.
Max.
Max.
±10
208
1.6
4.5
50
52
1
Unit
Unit
Unit
µC
µC
µA
µA
µA
nC
nC
nC
pF
pF
pF
pF
ns
ns
ns
ns
ns
ns
V
V
S
A
A
V
A
A
3/10