BUK7E04-40A,127 NXP Semiconductors, BUK7E04-40A,127 Datasheet - Page 6
![MOSFET N-CH TRENCH 40V I2PAK](/photos/5/32/53210/i__pak-3__to-220ab__sot226_pkg_sml.jpg)
BUK7E04-40A,127
Manufacturer Part Number
BUK7E04-40A,127
Description
MOSFET N-CH TRENCH 40V I2PAK
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet
1.BUK7E04-40A127.pdf
(14 pages)
Specifications of BUK7E04-40A,127
Package / Case
I²Pak, TO-220AB (3 straight leads + tab)
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
4.5 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
75A
Vgs(th) (max) @ Id
4V @ 1mA
Gate Charge (qg) @ Vgs
117nC @ 10V
Input Capacitance (ciss) @ Vds
5730pF @ 25V
Power - Max
300W
Mounting Type
Through Hole
Gate Charge Qg
117 nC
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
8.5 mOhms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
198 A
Power Dissipation
300 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934056701127
NXP Semiconductors
6. Characteristics
Table 6.
BUK7E04-40A
Product data sheet
Symbol
Static characteristics
V
V
I
I
R
Dynamic characteristics
Q
Q
Q
C
C
C
t
t
t
t
L
L
Source-drain diode
V
t
Q
DSS
GSS
d(on)
r
d(off)
f
rr
D
S
(BR)DSS
GS(th)
SD
DSon
iss
oss
rss
G(tot)
GS
GD
r
Characteristics
Parameter
drain-source breakdown
voltage
gate-source threshold voltage
drain leakage current
gate leakage current
drain-source on-state
resistance
total gate charge
gate-source charge
gate-drain charge
input capacitance
output capacitance
reverse transfer capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain inductance
internal source inductance
source-drain voltage
reverse recovery time
recovered charge
All information provided in this document is subject to legal disclaimers.
Conditions
I
I
I
see
I
see
I
see
V
V
V
V
V
see
V
see
I
T
V
T
V
R
from upper edge of drain mounting
base to centre ; T
from drain lead 6 mm from package
to centre of die ; T
from source lead to source bond
pad ; T
I
see
I
V
D
D
D
D
D
D
S
S
j
j
DS
DS
DS
DS
GS
GS
GS
DS
GS
Rev. 03 — 15 June 2010
G(ext)
= 25 °C; see
= 25 °C; see
= 40 A; V
= 20 A; dI
= 0.25 mA; V
= 0.25 mA; V
= 1 mA; V
= 1 mA; V
= 1 mA; V
= 25 A; V
Figure 10
Figure 10
Figure 10
Figure
Figure
Figure 15
= 40 V; V
= 40 V; V
= 0 V; V
= 0 V; V
= 30 V; R
= 10 V; I
= 10 V; I
= 0 V; V
= -10 V; V
= 10 Ω; T
j
= 25 °C
11; see
11; see
DS
GS
S
DS
DS
DS
GS
GS
DS
D
D
/dt = -100 A/µs;
GS
GS
L
DS
= 25 A; T
= 25 A; T
= 32 V; V
= 0 V; T
= V
= V
= V
Figure 13
Figure 14
= 1.2 Ω; V
GS
GS
= 20 V; T
= -20 V; T
= 25 V; f = 1 MHz;
j
= 0 V; T
= 0 V; T
= 25 °C
j
= 30 V; T
j
= 0 V; T
= 0 V; T
= 25 °C
GS
GS
GS
Figure 12
Figure 12
= 25 °C
; T
; T
; T
j
= 25 °C;
j
j
j
j
j
GS
j
j
j
= 25 °C;
= 175 °C;
= -55 °C;
= 175 °C;
= 25 °C;
N-channel TrenchMOS standard level FET
j
GS
= 175 °C
= 25 °C
= 25 °C
= 25 °C
j
j
j
= 10 V;
= -55 °C
= 25 °C
= 25 °C
= 10 V;
BUK7E04-40A
Min
36
40
2
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ
-
-
3
-
-
-
0.05
2
2
-
3.9
117
19
50
4300
1400
800
33
110
151
76
2.5
4.5
7.5
0.85
96
224
© NXP B.V. 2010. All rights reserved.
1680
-
Max
-
-
4
-
4.4
500
10
100
100
8.5
4.5
-
-
-
5730
1100
-
-
-
-
-
-
1.2
-
-
Unit
V
V
V
V
V
µA
µA
nA
nA
mΩ
mΩ
nC
nC
nC
pF
pF
pF
ns
ns
ns
ns
nH
nH
nH
V
ns
nC
6 of 14