PH8230E,115 NXP Semiconductors, PH8230E,115 Datasheet
PH8230E,115
Specifications of PH8230E,115
934057745115
PH8230E T/R
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PH8230E,115 Summary of contents
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PH8230E N-channel TrenchMOS logic level FET Rev. 04 — 17 November 2009 1. Product profile 1.1 General description Logic level N-channel enhancement mode Field-Effect Transistor (FET plastic package using TrenchMOS technology. This product is designed and qualified for ...
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... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 S source 2 S source 3 S source 4 G gate mb D mounting base; connected to drain 3. Ordering information Table 3. Ordering information Type number Package Name Description PH8230E LFPAK plastic single-ended surface-mounted package (LFPAK); 4 leads 4 ...
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... NXP Semiconductors 120 I der (%) 100 Fig 1. Normalized continuous drain current as a function of mounting base temperature (A) Limit −1 10 −1 10 Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PH8230E_4 Product data sheet 03aa23 120 P der (%) 150 200 0 T (°C) mb Fig 2 ...
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... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-mb) mounting base 10 Z th(j-mb) (K/W) δ = 0.5 1 0.2 0.1 0.05 0.02 single pulse −1 10 − Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration ...
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... NXP Semiconductors 6. Characteristics Table 6. Characteristics Symbol Parameter Static characteristics V drain-source (BR)DSS breakdown voltage V gate-source threshold GS(th) voltage I drain leakage current DSS I gate leakage current GSS R drain-source on-state DSon resistance Dynamic characteristics Q total gate charge G(tot) Q gate-source charge GS Q gate-drain charge GD C input capacitance ...
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... NXP Semiconductors ( 0.5 1 Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values − (A) −3 10 min typ −4 10 − Fig 7. Sub-threshold drain current as a function of gate-source voltage PH8230E_4 Product data sheet 003aaa371 ( 3 3 2.9 V 2. (V) DS Fig 6. Transfer characteristics: drain current as a function of gate-source voltage ...
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... NXP Semiconductors 100 2 3 DSon (mΩ Fig 9. Drain-source on-state resistance as a function of drain current; typical values ( Fig 11. Gate-source voltage as a function of gate charge; typical values PH8230E_4 Product data sheet 003aaa373 − (A) D Fig 10. Normalized drain-source on-state resistance factor as a function of junction temperature ...
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... NXP Semiconductors Fig 13. Source current as a function of source-drain voltage; typical values PH8230E_4 Product data sheet ( 150 ° 0.2 0.4 0.6 0.8 Rev. 04 — 17 November 2009 PH8230E N-channel TrenchMOS logic level FET 003aaa375 25 ° (V) SD © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 7. Package outline Plastic single-ended surface-mounted package (LFPAK); 4 leads 1/2 DIMENSIONS (mm are the original dimensions) UNIT 1.20 0.15 1.10 0.50 mm 0.25 1.01 0.00 0.95 0.35 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT669 Fig 14 ...
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... Revision history Document ID Release date PH8230E_4 20091117 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. PH8230E-03 20040302 PH8230E-02 20030429 PH8230E-01 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .4 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 9 Legal information 9.1 Data sheet status ...