MMBD4148,215 NXP Semiconductors, MMBD4148,215 Datasheet

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MMBD4148,215

Manufacturer Part Number
MMBD4148,215
Description
DIODE HIGH SPEED SWITCHING SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of MMBD4148,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Mounting Type
Surface Mount
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Current - Reverse Leakage @ Vr
500nA @ 75V
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
75V
Capacitance @ Vr, F
1.5pF @ 0V, 1MHz
Current - Average Rectified (io)
215mA (DC)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934063957215

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBD4148,215
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
1. Product profile
2. Pinning information
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
High-speed switching diode, encapsulated in a small SOT23 (TO-236AB)
Surface-Mounted Device (SMD) plastic package.
I
I
I
I
I
Table 1.
[1]
Table 2.
Symbol
V
I
t
Pin
1
2
3
R
rr
R
MMBD4148
High-speed switching diode
Rev. 01 — 4 June 2009
High switching speed: t
Low leakage current
Repetitive peak reverse voltage:
V
High-speed switching
General-purpose switching
When switched from I
RRM
Quick reference data
Pinning
75 V
Parameter
reverse voltage
reverse current
reverse recovery time
Description
anode
not connected
cathode
F
= 10 mA to I
rr
4 ns
R
= 10 mA; R
Conditions
V
R
= 75 V
L
= 100 ; measured at I
I
I
I
Low capacitance
Reverse voltage: V
Small SMD plastic package
Simplified outline
1
[1]
Min
-
-
-
3
R
2
= 1 mA.
Typ
-
-
-
Product data sheet
R
Graphic symbol
75 V
1
Max
75
0.5
4
006aaa764
3
Unit
V
ns
A
2

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MMBD4148,215 Summary of contents

Page 1

MMBD4148 High-speed switching diode Rev. 01 — 4 June 2009 1. Product profile 1.1 General description High-speed switching diode, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. 1.2 Features I High switching speed Low leakage ...

Page 2

... NXP Semiconductors 3. Ordering information Table 3. Type number MMBD4148 4. Marking Table 4. Type number MMBD4148 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FRM I FSM P tot ...

Page 3

... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-t) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table unless otherwise specified. amb Symbol [1] Pulse test: t [2] When switched from I [3] When switched from I MMBD4148_1 Product data sheet ...

Page 4

... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.4 0.6 0.8 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values MMBD4148_1 Product data sheet 006aab132 ...

Page 5

... NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms MMBD4148_1 Product data sheet ...

Page 6

... NXP Semiconductors 9. Package outline Fig 7. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description MMBD4148 [1] For further information and the availability of packing methods, see MMBD4148_1 Product data sheet 3.0 2.8 2 ...

Page 7

... NXP Semiconductors 11. Soldering 3 1.7 Fig 8. 4.6 2.6 Fig 9. MMBD4148_1 Product data sheet 3.3 2.9 1 Reflow soldering footprint MMBD4148 (SOT23/TO-236AB) 2 1.4 2.8 4.5 Wave soldering footprint MMBD4148 (SOT23/TO-236AB) Rev. 01 — 4 June 2009 MMBD4148 High-speed switching diode solder lands ...

Page 8

... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date MMBD4148_1 20090604 MMBD4148_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 4 June 2009 MMBD4148 High-speed switching diode Supersedes - © NXP B.V. 2009. All rights reserved ...

Page 9

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 10

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Revision history ...

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